Staff / Senior Staff Engineer Package Technology Development

recruitmatic pte. ltd.; Singapore; On-site; SGD 180,000 - 260,000; Full time

Job summary

Recruitmatic Pte. Ltd. is seeking an experienced engineer to lead outsourced package platform qualification and process optimization at OSAT subcontractors in Singapore.

You will drive definition of packaging tasks, risk assessments, and BOM decisions to meet stringent MTM, quality and reliability targets. You will coordinate across laminate/leadframe design, process rules, and supplier sites, ensuring design rule compliance and successful platform enablement.

Qualifications

• Master or Bachelor degree in Engineering disciplines.
• Minimum 10 years’ working experience of package development in new product introduction or process (pre-assembly, assembly and test) and 3 years in supporting project management.
• Experience in Module assembly, Wafer level package (WLP), bumping, eWLB and System in Package (SiP) will be a key advantage.
• Good knowledge of processes and material in both laminates and leadframe packages and interaction to the different functions (laminate/ leadframe design, design rules, process).
• Strong analytical skills, ability to deal with conflict. Live up to high quality standards. Good quality mind-set and excellent problem solving.

Responsibilities

• Responsible for outsourced package platform qualification and process optimization at subcontractors to meet time-to-market and quality targets.
• Define OSAT package definition tasks with Delta assessment and risk mitigation.
• Integrate unit processes till process freeze for assembly and test at subcons with clear specs for upload into Database.
• Apply and verify design rules based on baseline documents and equipment capabilities at assembly sites.
• Define process and BOM to meet MSL, reliability, and package requirements for development.
• Enable new package platforms and derivatives with OSAT support for development.
• Drive platform-related task force activities and lead technical problem solving.

Skills

Analytical skills

Conflict resolution

Quality mindset

Problem solving

Communication

Team collaboration

Education

Engineering degree(s)

Tools

Module assembly

WLP

Bumping

eWLB

SiP

Job description

My client is a big Semiconductor in Singapore.

Key responsibilities in your new role

• Responsible for outsourced package platform qualification (lead and follower products) and process optimization at subcons to meet the time-to-market, product quality level, process capability and assembly yield target.
• Responsible for package definition tasks in OSAT segment in defining project complexity definition with Delta assessment list, project category assessment and Perform project risk assessment with mitigation actions.
• Responsible for integration of unit processes till process freeze for assembly and test at subcons which entails creating assembly specification, marking instruction and packing specification for upload into Database.
• Apply and verify design rules based on established baseline documents as well as specific equipment and process capability of specific assembly sites. This includes OSATs technical capability assessment support role.
• Define process and select Bill of Material as needed to meet MSL, reliability level, and other specific package requirements for development and pre-development.
• Responsible for enabling of new package platform and derivatives packages, and support of technology and package development at OSAT. This includes new subcon enabling support role.
• As a driver or co-driver for platform related Task force activities and has ability to drive for technical problem solving.

Qualifications and skills to help you succeed

• Master or Bachelor degree in Engineering disciplines.
• Minimum 10 years’ working experience of package development in new product introduction or process (pre-assembly, assembly and test) and 3 years in supporting project management.
• Experience in Module assembly, Wafer level package (WLP), bumping, eWLB and System in Package (SiP) will be a key advantage.
• Good knowledge of processes and material in both laminates and leadframe packages and interaction to the different functions (laminate/ leadframe design, design rules, process)
• Good understanding of quality requirements / release criteria (e.g. JEDEC/AEC grade) that fits and matches product/package design and BOM sets selection.
• Strong analytical skills, ability to deal with conflict. Live up to high quality standards. Good quality mind-set and excellent problem solving.
• Demonstrates active knowledge transfer and best practice sharing across organizational boundaries, be ambitious and ability to make timely decisions.
• Highly motivated with the ability to prioritize, perform under pressure and get team members and stakeholders involved and to motivate them.
• Ability to collaborate and work as a team with various stakeholders and partners in multi-site/multi-cultural teams.
• Strong in communication and people interpersonal skills across all levels.
• Experience in Subcon management.