Global OSAT Operation Engineering

NXP Semiconductors Singapore Pte Ltd; Singapore; On-site; SGD 120,000 - 180,000; Full time

Job summary

NXP Semiconductors Singapore Pte Ltd is seeking an experienced engineering leader to drive yield, quality, reliability, and productivity improvements across OSAT sites. You will steer manufacturing excellence programs, lead subcontractor change management, and coordinate site transfers and capacity expansions.

You will partner with global Product Engineering, Quality, Reliability, Supply Chain and Manufacturing teams, review reports, and champion Smart Factory initiatives with AI/ML deployment

Qualifications

• Degree or MSc in Mechanical, Materials, Manufacturing, Electronics Engineering or equivalent.
• Experience in semiconductor assembly and packaging, OSAT, site transfer and qualification projects.
• Knowledge of DOE, SPC, FDC, process control methodologies, reliability qualification, and root cause analysis.

Responsibilities

• Provide technical leadership for yield, quality, reliability, and productivity programs across OSAT sites.
• Drive manufacturing excellence initiatives including cycle time reduction and process optimization.
• Review and approve subcontractor reports, PCN submissions, and CAPA actions.
• Lead OSAT site transfer, second-source qualification, and capacity expansion projects.
• Champion Smart Factory initiatives with AI/ML deployment and manufacturing digitalization solutions.

Skills

Technical leadership

Project management

Stakeholder mgmt

Communication

Cross-functional teams

Independent work

AI/ML familiarity

Industry 4.0

Education

Degree or MSc in Mechanical/Materials/Manufacturing/Electronics Engineering

Tools

DOE

SPC

FDC

Job description

Job Responsibilities:

• Provide technical leadership for yield, quality, reliability, and productivity improvement programs across OSAT sites.
• Drive manufacturing excellence initiatives including cycle time reduction, bottleneck elimination, equipment qualification, and process optimization.
• Review and approve subcontractor 8D, CQC, Safe Launch reports, PCN submissions, and corrective/preventive action plans.
• Drive manufacturing excellence initiatives including cycle time reduction, bottleneck elimination, equipment qualification, and process optimization.
• Drive qualification and implementation of subcontractor changes including material, equipment, process, manufacturing site, floor layout, and capacity expansion for supply assurance.
• Lead OSAT site transfer, second-source qualification, and capacity expansion projects for supply resilience and revenue growth.
• Own qualification planning, gap assessment, risk mitigation, Safe Launch execution, and PCN activities.
• Partner with global Product Engineering, Quality, Reliability, Supply Chain, and Manufacturing teams to ensure successful project execution and product commercialization.
• Lead supplier technical assessments, capability benchmarking, and readiness reviews for new and existing OSAT partners.
• Lead onsite root cause investigations and resolution of major quality incidents, yield excursions, customer issues, and severe incident escalations.
• Support package documentation management, including bond diagrams, package kits, assembly flows, qualification reports, and change records.
• Participate as Change Action Board (CAB), Independent Review Board(IRB), and qualification review member for NPI/NTI, site transfer, and process change approvals.
• Champion Smart Factory initiatives by working with OSATs on AI/ML deployment, predictive analytics, automated defect detection, and manufacturing digitalization solutions.
• Provide regular executive updates and recommendations to management on qualification status, supply risks, quality performance, and strategic OSAT initiatives.

Requirements:

• Degree or MSc Degree in Mechanical, Materials, Manufacturing, Electronics Engineering or equivalent.
• Minimum 8-10 years of semiconductor assembly and packaging experience, preferably in OSAT management, site transfer, and qualification projects.
• Technical knowledge in advanced packaging technologies such as WLCSP, FOWLP, Cu Pillar Bumping, and Flip-Chip. Additional experience in mainstream semiconductor packages including QFN, LQFP, and wire bond technologies will be an added advantage.
• Experience in package qualification, Safe Launch execution, change management (PCN), and subcontractor management. Knowledge of DOE, SPC, FDC, process control methodologies, reliability qualification, and root cause analysis techniques.
• Proven experience in yield improvement, quality management, and manufacturing productivity enhancement.
• Strong project management, leadership, and stakeholder management skills in a cross-functional global environment.
• Good communication and presentation skills with the ability to influence stakeholders at all organizational levels.
• Ability to work independently, manage multiple priorities, and drive projects to closure under tight timelines.
• Familiarity with AI/ML, Smart Factory, Industry 4.0 initiatives, and manufacturing digitalization is an added advantage.

More information about NXP in Singapore...

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