Staff Package Tech Engineer – OSAT Platform Dev

RECRUITMATIC PTE. LTD.; Singapore; On-site; SGD 120,000 - 180,000; Full time

Job summary

RECRUITMATIC PTE. LTD. in Singapore is assisting a high-profile semiconductor client in recruiting for a senior packaging engineer role.

You will lead outsourced package platform qualification for lead and follower products, optimize subcon processes to meet time-to-market, quality and assembly yield targets, and define OSAT package definitions with risk assessments and BOM decisions. You will enable new package platforms, support OSAT technology development, and drive platform-related task

Qualifications

• Master or Bachelor degree in Engineering disciplines.
• Minimum 10 years’ working experience of package development in new product introduction or process (pre-assembly, assembly and test) and 3 years in supporting project management.
• Experience in Module assembly, Wafer level package (WLP), bumping, eWLB and System in Package (SiP) will be a key advantage.
• Good knowledge of processes and material in both laminates and leadframe packages and interaction to the different functions (laminate/ leadframe design, design rules, process)
• Strong analytical skills, ability to deal with conflict. Live up to high quality standards. Good quality mind-set and excellent problem solving.
• Demonstrates active knowledge transfer and best practice sharing across organizational boundaries, be ambitious and ability to make timely decisions.
• Highly motivated with the ability to prioritize, perform under pressure and get team members and stakeholders involved and to motivate them.
• Ability to collaborate and work as a team with various stakeholders and partners in multi-site/multi-cultural teams.
• Strong in communication and people interpersonal skills across all levels.
• Experience in Subcon management.

Responsibilities

• Lead outsourced package platform qualification (lead and follower products) and optimize processes at subcons to meet time-to-market, product quality, process capability and assembly yield targets.
• Define package definitions in OSAT segments including Delta assessment, project category assessment and risk mitigation actions.
• Integrate unit processes to process freeze for assembly/test at subcons and create assembly/packing specifications for database upload.
• Apply and verify design rules based on baseline documents and equipment/process capability of specific assembly sites; support OSAT capability assessments.
• Define process and select BOM to meet MSL, reliability and package requirements for development and pre-development.
• Enable new package platforms and derivatives, supporting OSAT technology development.
• Drive platform-related Task Force activities and lead technical problem-solving.

Skills

Package development

Project management

OSAT collaboration

Quality standards (JEDEC/AEC)

Problem solving

Multi-site collaboration

Communication

Subcon management

Education

Bachelor's or Master's in Engineering

Job description

RECRUITMATIC PTE. LTD. in Singapore is assisting a high-profile semiconductor client in recruiting for a senior packaging engineer role.

You will lead outsourced package platform qualification for lead and follower products, optimize subcon processes to meet time-to-market, quality and assembly yield targets, and define OSAT package definitions with risk assessments and BOM decisions. You will enable new package platforms, support OSAT technology development, and drive platform-related task