Staff Engineer – Process Development, Dry Etch, NAND

1100 Micron SemiAsiaOP Pte Ltd; Singapore; On-site; SGD 80,000 - 100,000; Full time

Job summary

1100 Micron SemiAsiaOP Pte Ltd in Singapore seeks a Staff Engineer to drive unit process development for advanced NAND dry etch. The ideal candidate will have significant experience in optimizing processes and enhancing yield while mentoring junior engineers.

Responsibilities include collaborating with various process teams, conducting root-cause analysis, and integrating AI tools to improve efficiency. Candidates must hold an advanced degree in relevant fields and possess strong analytical skills. Join a team dedicated to continuous improvement and innovation.

Qualifications

• PhD ≥3 years, or Master’s ≥5 years, or Bachelor’s ≥7 years of relevant experience.
• Experience in dry etch process development and experimental design/data analysis.

Responsibilities

• Develop and optimize dry etch processes.
• Lead root-cause/failure-mode analysis.
• Support pilot-line sustainment and process transfer.

Skills

Dry etch fundamentals

Analytical problem-solving

Cross-functional stakeholder management

Education

PhD in relevant field

Master's in relevant field

Bachelor's in relevant field

Tools

Python

DOE/SPC

Job description

Job / Role Summary

The Staff Engineer drives unit process development and module execution for advanced NAND dry etch, owning defined process levels and delivering robust process solutions that meet program, yield, and manufacturability targets. Success requires deep process fundamentals, disciplined DOE/SPC execution, and strong cross‑functional influence to solve complex structural challenges and enable process transfer.

Responsibilities

• Develop and optimize dry etch processes to meet physical/structural and electrical requirements for advanced NAND products.
• Improve process capability by reducing variability and driving cost/process margin improvements.
• Lead root‑cause/failure‑mode analysis for process/hardware limitations and drive vendor/supplier engagement for solutions.
• Collaborate with Process Integration and adjacent process areas (Wet Etch, CVD/Diffusion, Metals, Lithography, CMP) to integrate solutions and resolve cross‑module interactions.
• Support pilot‑line sustainment and process transfer to manufacturing sites as required.
• Contribute to fundamental research and innovation efforts that improve next‑generation NAND scaling.
• Mentor junior engineers and contribute to knowledge sharing within the dry etch team.
• Integrate AI‑assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational standards and legal requirements.
• Contribute to a culture of continuous improvement by identifying, testing, and sharing AI‑enabled enhancements within one’s scope of work.

Candidate Profile

Minimum Qualifications / Experience

• PhD ≥3 years, or Master’s ≥5 years, or Bachelor’s ≥7 years of relevant experience in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or a related field.
• Demonstrated experience in dry etch process development and experimental design/data analysis.

Must‑have Technical Skills

• Dry etch fundamentals; understanding of plasma physics/chemistry and reactor behavior.
• DOE/SPC and statistical analysis skills.

Must‑have Soft Skills

• Strong analytical problem‑solving; ability to manage multiple technical priorities and deliver on commitments.
• Cross‑functional stakeholder management and communication.

Highly Desirable / Preferred

• Python/data science basics or GenAI‑enabled analysis/automation experience.

Equal Employment Opportunity Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.