Dry Etch - MTS, PD, Advance NAND

Micron Technology; Singapore; On-site; SGD 90,000 - 130,000; Full time

Job summary

Micron Technology in Singapore is seeking a Member of Technical Staff (MTS) to join their innovative Dry Etch team. Your role involves leading essential modules and managing the process roadmap while collaborating with various teams.

The ideal candidate has extensive experience in dry-etch process development and a strong research background. Responsibilities include technology development and mentoring less-experienced engineers. The position offers opportunities to work on groundbreaking NAND research projects.

Qualifications

• 6–10 years of experience in dry-etch process development.
• 4–5 years in NAND, DRAM, or logic module development.
• Demonstrated experience managing technical projects.

Responsibilities

• Lead development of Dry Etch technology and essential modules.
• Collaborate with hardware teams and develop equipment roadmap.
• Provide critical updates to upper management on project status.

Skills

Dry Etch technology

Process development in R&D

Leadership in problem-solving

Statistical process control

Data science basics / Python coding

Education

Ph.D. in relevant field

Bachelor’s or Master’s in relevant field

Tools

MS Office

SAS software (JMP)

Job description

Position Summary

As a Member of Technical Staff (MTS) at Micron, you will join a groundbreaking Next Generation NAND research and development Dry Etch team. You will lead critical modules, operate powerful dry‑etch chambers, and manage the process roadmap to achieve program and yield goals while collaborating closely with process integration and other areas such as Wet Etch, CVD, Diffusion, Metals, Lithography, and CMP.

Key Responsibilities

• Lead development of Dry Etch technology and essential modules.
• Become a Dry Etch area expert and develop/innovate dry‑etch processes to meet structural and electrical specifications.
• Work closely with hardware teams to develop the equipment roadmap for current and upcoming NAND products.
• Show expertise in dry‑etch technology fundamentals and possess a mechanistic understanding of how process parameters affect outcomes.
• Collaborate and lead multi‑functional teams to solve complex structural problems.
• Present process and technology development plans for current and upcoming technology nodes.
• Stay proactive in predicting when and how future issues could arise and build mitigation plans.
• Contribute to the Technical Leadership Program by mentoring less‑experienced engineers and encouraging skill development within the team.
• Work on critical modules such as high‑aspect‑ratio (HAR), tier‑by‑tier etches, well‑contact, and staircase processes.
• Collaborate with other process areas to find opportunities and drive toward collaborative solutions.
• Guide other areas’ technology roadmaps and lead or be part of multi‑functional task‑force groups driving toward a target.
• Gain general expertise in other areas’ process hardware or technologies.
• Interact with Dry Etch peers and serve as a resource and guide for colleagues in dry‑etch technology and/or project management.
• Provide critical updates to upper management on project status and impacts.

Key Qualifications

• Demonstrated interest in a research and development environment.
• 6–10 years’ experience in dry‑etch process development in R&D moving into manufacturing.
• 4–5 years of pertinent experience in NAND, DRAM, or logic module development involving multi‑functional groups.
• Knowledge of plasma physics, chemistry, transport, or surface phenomena gained through experience and/or coursework.
• Demonstrated leadership in problem‑solving and experience managing technical projects.
• Understanding of various types of plasma dry‑etch reactors (e.g., RF sources, chemistries).
• Expertise in statistical process control and analysis.
• Experience solving scalability problems of deep high‑aspect‑ratio silicon/dielectric etches with a fundamental understanding of advanced conventional and unconventional (tailored) pulsing schemes.
• Lead supplier head‑to‑head engagements.
• Data science basics / Python coding / AI coding experience preferred over candidates without this experience.
• Strong computer skills, including MS Office and SAS software such as JMP.

Education

• Ph.D. or equivalent experience in Chemical, Mechanical, Electrical, Material Science, Physics, Chemical Physics, Chemistry, Semiconductor Engineering, or related fields with a minimum of 10 years of dry‑etch process development experience.
• Bachelor’s or Master’s in Chemical, Mechanical, Electrical, Material Science, Physics, Chemical Physics, Chemistry, Semiconductor Engineering, or related fields with a minimum of 12 years of applicable dry‑etch process development experience.

Equal Employment Opportunity Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran, or disability status.