Principal Engineer – NAND Process Pathfinding – Dry Etch

Micron Technology, Inc; Singapore; On-site; SGD 180,000 - 240,000; Full time

Job summary

Micron Technology, Inc. in Singapore is seeking a Principal Engineer – Dry Etch to lead development of high‑performance dry etch chambers and define the process roadmap to meet yield targets.

You will explore advanced dry etch methods, develop new plasma chemistries, and drive data analytics and AI/ML methods to accelerate learning and optimization. The role requires deep expertise in ICP/CCP plasma etch, plasma–surface interactions, and semiconductor integration, plus ability to mentor teams

Qualifications

• Experience with ICP and CCP plasma etch in semiconductor process development.
• Strong understanding of plasma–surface interactions, etch chemistry, profile control, and dry etch equipment fundamentals.
• Solid foundation in plasma physics, materials interactions, and semiconductor process integration.
• Experience developing and refining dry etch processes for advanced semiconductor technologies.
• Familiarity with statistical analysis, data analytics, and process optimization methodologies.
• Strong cooperative abilities to work efficiently across multidisciplinary engineering teams.

Responsibilities

• Explore advanced dry etch methods to satisfy structural, electrical, yield, and integration demands across the NAND roadmap.
• Develop new plasma chemistries, process technologies, and equipment capabilities.
• Apply analytics and AI/ML tools to accelerate process learning and improve etch performance.
• Drive process pathfinding through automation, predictive modeling, and data‑driven decisions.
• Collaborate with Process Integration, Thin Films, Wet Etch, Diffusion, Lithography, CMP, and Device teams.
• Leverage AI-enabled tools and digital workflows to accelerate process development and R&D productivity.

Skills

ICP/CCP plasma etch

plasma–surface interactions

data analytics

cross-functional collaboration

process development

AI/ML concepts

Education

PhD or MS with 7–10 years in dry etch

semiconductor process development

Job description

Principal Engineer – Dry Etch

Micron’s Advanced NAND Process Pathfinding Team is developing next‑generation memory technology. As a Principal Engineer – Dry Etch you will manage new, high‑performance dry etch chambers and lead the process roadmap to meet program and yield targets.

Responsibilities

• Explore advanced dry etch methods to satisfy structural, electrical, yield, and integration demands throughout the NAND technology roadmap.
• Develop new plasma chemistries, process technologies, and equipment capabilities to enable future technology nodes.
• Apply advanced data analytics, AI/ML tools, and statistical methodologies to accelerate process learning and improve etch performance.
• Drive process pathfinding through automation, predictive modeling, and data‑driven decision making.
• Collaborate closely with Process Integration, Thin Films, Wet Etch, Diffusion, Lithography, CMP, and Device teams to advance technology development and manufacturability.
• Leverage AI‑enabled engineering tools, advanced analytics, and digital workflows to accelerate process development, improve decision‑making, and enhance R&D productivity across thin film initiatives.

Minimum Qualifications

• Practical experience with ICP and/or CCP plasma etch technologies in semiconductor process development.
• Strong understanding of plasma–surface interactions, etch chemistry, profile control, and dry etch equipment fundamentals.
• Solid foundation in plasma physics, materials interactions, and semiconductor process integration.
• Experience developing and refining dry etch processes for advanced semiconductor technologies.
• Familiarity with statistical analysis, data analytics, and process optimization methodologies.
• Strong cooperative abilities to work efficiently across multidisciplinary engineering teams.

Preferred Qualifications

• PhD or MS with 7–10 years of relevant experience in dry etch/semiconductor process development.
• Experience with high‑aspect‑ratio etch, advanced pattern transfer, selective etch, and structural process optimization.
• Experience applying machine learning, predictive modeling, automation, or virtual process modeling to technology development.
• Strong problem‑solving abilities and capacity to work autonomously in a dynamic development setting.
• Excellent communication and presentation skills.
• Experience mentoring engineers or leading technical projects is beneficial.

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.