Principal Engineer – NAND Process Pathfinding – Dry Etch

1100 Micron SemiAsiaOP Pte Ltd; Singapore; On-site; SGD 180,000 - 240,000; Full time

Job summary

Micron invites applications for a Principal Engineer – Dry Etch to lead advanced dry etch research and manage high‑performance etch chambers within the NAND Process Pathfinding Team.

The role focuses on developing new plasma chemistries, process technologies, and equipment capabilities to enable future technology nodes, while applying data analytics and AI/ML to accelerate learning and improve etch performance.

Qualifications

• Experience with ICP and/or CCP plasma etch technologies in semiconductor process development.
• Strong understanding of plasma–surface interactions, etch chemistry, profile control and dry etch equipment fundamentals.
• Solid foundation in plasma physics, materials interactions and semiconductor process integration.
• Experience in developing and refining dry etch processes for advanced semiconductor technologies.
• Familiarity with statistical analysis, data analytics, and process optimization methodologies.
• Strong cooperative abilities with the capacity to work efficiently across multidisciplinary engineering teams.

Responsibilities

• Explore advanced dry etch methods to satisfy structural, electrical, yield and integration demands throughout the NAND technology roadmap.
• Develop new plasma chemistries, process technologies and equipment capabilities to enable future technology nodes.
• Apply advanced data analytics, AI/ML tools, and statistical methodologies to accelerate process learning and improve etch performance.
• Drive process pathfinding through automation, predictive modeling and data‑driven decision making.
• Work closely with Process Integration, Thin Films, Wet Etch, Diffusion, Lithography, CMP and Device teams to drive technology development and manufacturability forward.
• Leverage AI‑enabled engineering tools, advanced analytics and digital workflows to accelerate process development, improve decision‑making, enhance knowledge management and increase R&D productivity across thin film technology initiatives.

Skills

Plasma etch

Plasma–surface interactions

Data analytics

AI/ML tools

Cross‑functional teamwork

Education

PhD/MS in related field

Tools

AI/ML tools

Job description

Micron invites applications for the Principal Engineer – Dry Etch position within the Advanced NAND Process Pathfinding Team. This role focuses on leading advanced dry etch research, managing high‑performance etch chambers, and delivering process innovations to support future NAND nodes.

Responsibilities

• Explore advanced dry etch methods to satisfy structural, electrical, yield, and integration demands throughout the NAND technology roadmap.
• Develop new plasma chemistries, process technologies, and equipment capabilities to enable future technology nodes.
• Apply advanced data analytics, AI/ML tools, and statistical methodologies to accelerate process learning and improve etch performance.
• Drive process pathfinding through automation, predictive modeling, and data‑driven decision making.
• Work closely with Process Integration, Thin Films, Wet Etch, Diffusion, Lithography, CMP, and Device teams to drive technology development and manufacturability forward.
• Leverage AI‑enabled engineering tools, advanced analytics, and digital workflows to accelerate process development, improve decision‑making, enhance knowledge management, and increase R&D productivity across thin film technology initiatives.

Minimum Qualifications

• Practical experience with ICP and/or CCP plasma etch technologies in semiconductor process development.
• Strong understanding of plasma‑surface interactions, etch chemistry, profile control, and dry etch equipment fundamentals.
• Solid foundation in plasma physics, materials interactions, and semiconductor process integration.
• Experience in developing and refining dry etch processes for advanced semiconductor technologies.
• Familiarity with statistical analysis, data analytics, and process optimization methodologies.
• Strong cooperative abilities with the capacity to work efficiently across multidisciplinary engineering teams.

Preferred Qualifications

• PhD/MS with 7–10 years of relevant experience in dry etch / semiconductor process development.
• Experience with high aspect ratio etch, advanced pattern transfer, selective etch, and structural process optimization.
• Experience applying machine learning, predictive modeling, automation, or virtual process modeling to technology development.
• Strong problem‑solving abilities and the capacity to work autonomously in a dynamic development setting.
• Excellent communication and presentation skills.
• Experience mentoring engineers or leading technical projects is beneficial.

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.