Dry Etch - SMTS, PD, Advance NAND

Micron Technology; Singapore; On-site; SGD 100,000 - 130,000; Full time

Job summary

Micron Technology is seeking a Senior Member of Technical Staff (SMTS) for their Dry Etch team in Singapore. The role involves defining and developing advanced dry etch processes for NAND technologies. Candidates should have over 12 years in dry etch process development within R&D, along with leadership experience. Responsibilities include collaborating cross-functionally and mentoring junior engineers. The position offers an opportunity to innovate in a cutting-edge environment and participate in patent programs.

Qualifications

• 12-15 years’ experience in dry etch process development in R&D, with 7-10 years in memory products.
• In-depth knowledge of plasma physics and chemistry.
• Experience in managing technical projects.

Responsibilities

• Own key NAND dry etch process levels and modules.
• Drive multi-functional execution across technology development.
• Lead First-Of-a-Kind dry etch process development.

Skills

Process development

Problem-solving

Data analysis

Statistical process control

Leadership

Education

PhD in relevant fields

BS/MS in relevant fields

Tools

MS Office

SAS software like JMP

Job description

Our vision is to transform how the world uses information to enrich life for all.

Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities.

Position Overview

As a SMTS (Senior Member of Technical Staff), you will be part of revolutionary Next Generation NAND research & development Dry Etch team driving Advanced NAND and dry etch technology forward. A SMTS Dry Etch Engineer is a senior individual contributor responsible for defining, developing, and transferring advanced dry etch processes for Micron NAND technologies. Work directly with process integration and other process areas such as Wet Etch, CVD, Diffusion, Metals, Lithography & CMP. Own the process roadmap to meet program and yield goals.

Responsibilities

• The SMTS Dry Etch Engineer owns key NAND dry etch process levels and modules, translating technology challenges into executable roadmaps for N, N+1, and N+2 nodes.
• Serve as the primary Dry Etch representative in program and module meetings for owned process areas.
• Drive multi-functional execution across Technology Development, Process Integration and Manufacturing.
• Develop and innovate dry etch processes to meet structural and electrical specifications for advanced NAND devices.
• Lead First-Of-a-Kind (FOAK) dry etch process development, including recipe architecture, EPD strategy, control plans, and integration alignment.
• Establish tool redundancy, run-to-run controls, and E3 monitors to improve process robustness and manufacturability.
• Independently meet Process maturity, CSPEC, SPC, and qualification criteria and timelines for owned process levels.
• Provide clear technical status and risk updates to program stakeholders.
• Collaborate with equipment and supplier teams to define and implement process-level hardware roadmaps.
• Apply model-based and data-driven problem solving to resolve complex yield, defectivity, and integration issues.
• Contribute towards Technical Leadership Program.

Technical Leadership and Development

• Act as a recognized technical expert within Dry Etch for owned process areas.
• Mentor MTS engineers, interns, and early-career staff on technical problem solving, data analysis, and plasma etch fundamentals.
• Participate in Micron patent programs, technical seminars, and knowledge-sharing forums.
• Continuously develop technical breadth and depth in dry etch technology and adjacent process areas.
• Solid presentation skills in executive meetings. Present process and technology roadmaps for current and future technology nodes.
• Comfortable in influencing other process areas technology roadmaps.

Qualifications

• Demonstrated aptitude for research and development environment.
• 12-15 years’ experience in dry etch process development in R&D (NAND, DRAM or Logic) transferring to manufacturing; of which 7-10 years in memory products such as NAND, and DRAM.
• In-depth knowledge of plasma physics, plasma chemistry, transport or surface phenomena gained through experience and/or coursework.
• Demonstrated leadership in problem solving; experience in managing technical projects.
• Understanding of various types of plasma dry etch reactors (e.g., RF sources, chemistries).
• Expertise in statistical process control and analysis.
• Experience in solving scalability problems of deep high aspect ratio silicon/dielectric etches with a fundamental understanding of advanced conventional and unconventional (tailored) pulsing schemes.
• Proven ability to independently drive technical execution and influence multi-functional teams.
• Strong computer skills, including MS Office, and SAS software like JMP and similar.
• Candidates having AI developing and coding capability could be preferred.

Education

• PhD (Chemical, Mechanical, Electrical, Material Science, Physics, Chemical physics, Chemistry, Semiconductor engineering or relevant majors) with at least 12 years of relevant dry etch process development experience.
• BS/MS (Chemical, Mechanical, Electrical, Material Science, Physics, Chemical Physics, Chemistry, Semiconductor engineering or relevant majors) with at least 15 years of relevant dry etch process development experience.

Equal Employment Opportunity Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.