Staff Engineer, NTI Metrology

Micron Technology; Singapore; On-site; SGD 120,000 - 180,000; Full time

Job summary

Micron Technology in Singapore seeks a senior metrology-focused engineer to own development, qualification and deployment of advanced metrology applications for 3D NAND process development, with emphasis on FIB and AFM/SEM/WLI.

You will lead evaluation, qualification and deployment of FOAK metrology systems, drive technology roadmaps, and collaborate with suppliers and internal teams to accelerate process learning and yield improvements.

Qualifications

• Master's or PhD degree in a relevant science or engineering field.
• 7+ years semiconductor metrology development experience with ownership of new metrology apps.
• 5+ years hands-on experience in FIB and at least one other advanced metrology technique (AFM, SEM or WLI).
• Experience qualifying and deploying metrology technologies with supplier engagement.

Responsibilities

• Own development, qualification, and deployment of advanced metrology applications for 3D NAND process development including FIB and AFM/SEM/WLI.
• Develop and implement metrology solutions to close inline detection gaps and accelerate process learning.
• Lead evaluation and deployment of next-generation metrology systems and FOAK technologies across platforms.
• Establish technology roadmaps aligned with future NAND requirements and collaborate with equipment suppliers.

Skills

Metrology development

Inline monitoring

AI/ML in metrology

Cross-functional collaboration

Education

Master's or PhD in Materials Science, Mechanical Engineering, Electrical Engineering or Applied Physics

Tools

FIB

AFM

SEM

WLI

Job description

Own the development, qualification, and deployment of advanced metrology applications for 3D NAND process development, with primary emphasis on Focused Ion Beam (FIB) and one or more of the following:

Atomic Force Microscopy (AFM)

Optical interferometry or White Light Interferometry (WLI)

Semiconductor electrical or non-contact characterization methods

Develop and implement innovative metrology solutions utilizing FIB, AFM, SEM, and related characterization techniques to close inline detection gaps and accelerate process learning.

Lead the evaluation, qualification, and deployment of next-generation metrology systems and First-of-a-Kind (FOAK) technologies, including assessment of measurement capability, accuracy, repeatability, throughput, automation, and manufacturing readiness across FIB, AFM, SEM, and other advanced metrology platforms.

Establish and drive technology roadmaps, ensuring alignment with future NAND technology requirements while fostering strong technical partnerships with equipment suppliers and industry collaborators.

Identify and develop modeling opportunities using metrology, defect detection, artificial intelligence (AI), and machine learning (ML) techniques in conjunction with metrology data analytics to understand electrical failure signatures observed at probe and their impact on product reliability, yield, and performance.

Collaborate closely with Process Integration, Yield Enhancement, Process Development Engineering and Manufacturing teams to develop innovative characterization solutions and enable rapid technology deployment

Qualifications:

Master's or PhD degree in Materials Science, Mechanical Engineering, Electrical Engineering or Applied Physics.

Minimum 7 years of semiconductor metrology development experience with demonstrated ownership and experience developing new metrology applications, recipes, methodologies or inline monitoring solutionsacross advanced characterization platforms, including FIB and one or more of the following: AFM, SEM, or WLI (not users of Metrology data).

Minimum 5 years of hands-on experience in Focused Ion Beam (FIB) and at least one additional advanced metrology technique from the following

Atomic Force Microscopy (AFM)

While Light Interferometry (WLI)

Demonstrated track record developing advanced semiconductor metrology applications for process characterization, inline monitoring, root-cause analysis, yield improvement, reliability investigations, and technology transfer, including qualification of new metrology technologies and direct engagement with suppliers to establish application capability and technology roadmaps.

Candidates whose experience is primarily limited to process engineering, yield engineering, failure analysis, or data analysis roles without direct metrology application development responsibility will not be considered.