Staff Engineer - NAND Thin-Film Process Development

Micron Technology, Inc.; Singapore; On-site; SGD 120,000 - 180,000; Full time

Job summary

Micron Technology, Inc. is seeking a Staff Engineer to lead NAND Advanced Thin Films process development, owning defined portions of the dielectric/carbon film space with robust execution and cross-functional collaboration.

You will translate experimental results into scalable process improvements, drive module ownership, and integrate AI-assisted insights to boost efficiency while maintaining engineering standards and regulatory compliance.

Qualifications

• PhD ≥3 years, or Master’s ≥5 years, or Bachelor’s ≥7 years in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or related field.
• Demonstrated thin film R&D / PD experience and ability to link process conditions to material properties/device behavior.
• Familiarity with fab metrology and film characterization methods (structural/mechanical/optical/electrical).

Responsibilities

• Develop, optimize, and characterize thin film processes (CVD/Diffusion) to meet performance, reliability, and manufacturability targets.
• Own defined portions of a process module or sub-module; track margins, sensitivities, and integration risks.
• Correlate material, structural, and electrical data to guide process optimization; support failure analysis and RCA.
• Build hands-on knowledge of dielectric/carbon film equipment; support tool qualifications and upgrades.
• Mentor junior engineers and communicate results through reviews, data summaries, and reports.

Skills

Thin film deposition

CVD processes

Materials characterization

Dielectric films

Cross-functional collaboration

Data analysis

Education

PhD in Electrical Engineering

Master's in Materials Science

Bachelor's in Physics

Tools

Fab metrology equipment

Thin film deposition equipment

Plasma process equipment

Job description

Micron Technology, Inc. is seeking a Staff Engineer to lead NAND Advanced Thin Films process development, owning defined portions of the dielectric/carbon film space with robust execution and cross-functional collaboration.

You will translate experimental results into scalable process improvements, drive module ownership, and integrate AI-assisted insights to boost efficiency while maintaining engineering standards and regulatory compliance.