Senior Principal Engineer – Advanced NAND Thin Films

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE LTD; Singapore; On-site; SGD 180,000 - 280,000; Full time

Job summary

Micron Technology, Inc. in Singapore seeks a Principal Engineer in Process Development – Advance Thin Film to lead strategic development of structural and electrical film processes for NAND memory devices.

You will drive roadmaps, mentor teams, and ensure smooth transfer of new processes to manufacturing. The role demands a PhD or equivalent and 5–10 years in thin film R&D for NAND processes, with deep expertise in CVD, diffusion films, and advanced characterization.

Qualifications

• PhD or equivalent degree in Materials Science, Chemical Engineering, Physics, Chemistry, Electrical Engineering, or a related field.
• 5–10 years of Thin Film R&D experience for NAND processes, including CVD and diffusion thin films.

Responsibilities

• Define and implement the technical strategy for structural and electrical film process development for NAND devices.
• Lead multi-functional teams to develop, integrate, and scale thin film processes for advanced NAND structures.
• Oversee end-to-end development of process modules with manufacturability and scalability in mind.
• Resolve complex technical challenges with root-cause analysis and mitigation of failures.
• Mentor senior engineers and shape the technical direction across the organization.

Education

PhD or equivalent in Materials Science / Chemical Engineering / Physics / Chemistry / Electrical Engineering

Tools

XRR

Ellipsometry

SEM

TEM

SIMS

XPS

Gas delivery systems

Job description

Micron Technology, Inc. in Singapore seeks a Principal Engineer in Process Development – Advance Thin Film to lead strategic development of structural and electrical film processes for NAND memory devices.

You will drive roadmaps, mentor teams, and ensure smooth transfer of new processes to manufacturing. The role demands a PhD or equivalent and 5–10 years in thin film R&D for NAND processes, with deep expertise in CVD, diffusion films, and advanced characterization.