Principal Engineer, Thin Films - NAND Process Innovator

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE LTD; Singapore; On-site; SGD 180,000 - 240,000; Full time

Job summary

Micron Semiconductor Asia Operations Pte Ltd is seeking a Principal Engineer / MTS (Thin Films) to architect and deploy next-generation thin film deposition methods for NAND devices. You will spearhead process development, mentor engineers, and collaborate across Device Engineering, Process Integration, and Yield teams to push reliability and performance.

The role emphasizes leadership in materials, deposition, and device integration with opportunities to apply AI and advanced analytics to

Qualifications

• Hands-on expertise across CVD, LPCVD, PECVD, ALD, PEALD, and MOCVD processes.
• Deep understanding of thin film reactors, material properties, and how they influence device performance and reliability.
• Strong foundation in plasma physics, transport phenomena, or surface chemistry.
• Demonstrated success in developing new thin film materials and deposition methods from concept to integration.
• Proven leadership in driving technical programs and engaging effectively with equipment and materials vendors.

Responsibilities

• Advance thin film process development to meet demanding structural, electrical, and reliability targets across the NAND roadmap.
• Lead the creation of thin films for next-generation NAND cells, including dielectric, conductive, interface, and charge-storage layers.
• Explore new materials, precursor chemistries, and deposition techniques to unlock future scaling and architectural breakthroughs.
• Partner across fields — collaborating closely with Device Engineering, Process Integration, and Yield teams to improve cell performance, reliability, and manufacturability.
• Lead technical task forces and mentor engineers, resolving complex structural and integration issues while establishing best-practice guidelines for the broader team.
• Leverage AI-enabled engineering tools, advanced analytics, and digital workflows to accelerate process development, improve decision-making, enhance knowledge management, and increase R&D productivity across thin film technology initiatives.

Skills

CVD/ALD/PECVD/PEALD/MOCVD family

Thin film reactor knowledge

Plasma physics/chemistry basics

Technical leadership

Data analysis / SPC

AI in semiconductor processes

Education

PhD/MS in a relevant field

Job description

Micron Semiconductor Asia Operations Pte Ltd is seeking a Principal Engineer / MTS (Thin Films) to architect and deploy next-generation thin film deposition methods for NAND devices. You will spearhead process development, mentor engineers, and collaborate across Device Engineering, Process Integration, and Yield teams to push reliability and performance.

The role emphasizes leadership in materials, deposition, and device integration with opportunities to apply AI and advanced analytics to