Staff Engineer, Chip-Package Integration & AI

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD.; Singapore; On-site; SGD 150,000 - 190,000; Full time

Job summary

Micron Semiconductor Asia Operations Pte. Ltd. is seeking a Staff Engineer, Package-Silicon Integration, to drive integration for next-generation NAND packaging technologies.

You will collaborate across silicon design, wafer fabrication, package design, assembly, reliability, and manufacturing to mitigate chip-package interaction risks. You will independently lead complex workstreams, develop integration solutions, and apply AI-enabled data-driven methods to accelerate learning and robust design

Qualifications

• Bachelor’s degree or higher in a technical discipline as listed.
• Min 4–5 years of relevant semiconductor experience in package-silicon integration or related fields.
• Proven ability to independently lead complex technical investigations.

Responsibilities

• Lead CPI risk assessments for new silicon, package architectures, materials, and processes.
• Partner with silicon, package, wafer fab, and assembly teams to resolve integration challenges.
• Lead investigations using DOE, statistical analysis, and AI-enabled approaches.
• Drive root-cause analysis for yield, quality, reliability, and manufacturability issues.
• Define test vehicles, characterization strategies, and qualification plans.
• Translate findings into design rules, specifications, and BKMs.
• Leverage AI, automation, and data analytics to improve efficiency and decision-making.
• Drive technology readiness and transition of new silicon and package technologies to manufacturing.
• Identify gaps and develop scalable technical solutions.
• Communicate risks and recommendations across teams and leadership.
• Provide technical guidance and promote AI-enabled ways of working.

Skills

Chip-Package Interaction

Technical leadership

AI-enabled analytics

Data-driven engineering

Education

Bachelor’s degree or higher in Mechanical, Materials, Electrical/Electronic, Chemical, Semiconductor Engineering, Physics, or related

Job description

Micron Semiconductor Asia Operations Pte. Ltd. is seeking a Staff Engineer, Package-Silicon Integration, to drive integration for next-generation NAND packaging technologies.

You will collaborate across silicon design, wafer fabrication, package design, assembly, reliability, and manufacturing to mitigate chip-package interaction risks. You will independently lead complex workstreams, develop integration solutions, and apply AI-enabled data-driven methods to accelerate learning and robust design