Senior Package-Silicon Integration Engineer (AI-Driven)

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE LTD; Singapore; Vor Ort; SGD 120.000 - 180.000; Vollzeit

Zusammenfassung

Micron Technology, Inc. invites a Staff Engineer, Package-Silicon Integration to advance next‑generation NAND packaging technology. You will collaborate across silicon design, wafer fabrication, package design, assembly, reliability, and manufacturing to mitigate CPI risks.

You will lead complex technical workstreams, develop integration solutions, and apply data‑driven methods including AI-enabled analytics to accelerate learning and ensure robust design and manufacturing.

Qualifikationen

• Bachelor’s degree or higher in a related technical discipline.
• 4–5 years of semiconductor experience in package-silicon integration or related fields.
• Ability to independently lead complex technical investigations.

Aufgaben

• Lead CPI risk assessments for new silicon and package architectures.
• Collaborate across silicon design, wafer fab, and assembly teams to resolve integration challenges.
• Lead technical investigations using DOE, statistics, and AI-driven approaches.
• Drive root-cause analysis for yield, quality, reliability, and manufacturability issues.
• Translate learnings into design rules, specifications, and manufacturing controls.
• Communicate risks and recommendations to engineering leadership.

Kenntnisse

CPI risk assessment

DOE & PFMEA

Data analytics

AI analytics

Cross-functional leadership

Ausbildung

Bachelor’s degree or higher in Mechanical, Materials, Electrical/Electronic, Chemical, Semiconductor Engineering, Physics, or related

Tools

Python

DOE Tools

Statistical Software

Jobbeschreibung

Micron Technology, Inc. invites a Staff Engineer, Package-Silicon Integration to advance next‑generation NAND packaging technology. You will collaborate across silicon design, wafer fabrication, package design, assembly, reliability, and manufacturing to mitigate CPI risks.

You will lead complex technical workstreams, develop integration solutions, and apply data‑driven methods including AI-enabled analytics to accelerate learning and ensure robust design and manufacturing.