Staff Advance Packaging Designer

ADVANCED MICRO DEVICES (SINGAPORE) PTE LTD; Singapore; On-site; SGD 120,000 - 180,000; Full time

Job summary

ADVANCED MICRO DEVICES (SINGAPORE) PTE LTD is seeking an experienced Package Design Engineer to lead end-to-end substrate and interposer design for 2.5D/3D architectures. The role emphasizes AI-driven design techniques, automation, and fast-paced execution to deliver high-quality results.

You will collaborate with SI/PI, mechanical, and SOC teams, mentor junior engineers, and drive continuous improvement in packaging methodologies while interfacing with OSATs and vendors in a dynamic data

Qualifications

• Bachelor’s or higher degree in Electrical Engineering, Computer Engineering, or related field.
• Experience in designing complex substrate design or Silicon Bridge or Interposers.
• Hands-on experience with AI/ML and automation to improve design productivity and quality.

Responsibilities

• Lead end-to-end package design execution for complex products, ensuring performance, cost, quality, and schedule targets are met.
• Handle multiple concurrent design programs in a fast-paced and high-pressure environment.
• Develop substrate layouts, bump maps, and interposer designs for advanced packaging (2.5D/3D, chiplet-based architectures).
• Drive design decisions through close collaboration with SI/PI, mechanical, and SOC teams.
• Partner with internal engineering teams, OSATs, and substrate suppliers to deliver optimized solutions.

Skills

Package design

Substrate design

AI/ML for design

Cross-functional collaboration

Education

Bachelor’s or higher degree in Electrical Engineering, Computer Engineering, or related field

Tools

EDA tools

Job description

THE ROLE:

Help turn “possibility” into “reality” every day. At AMD, we push the boundaries of what is possible by delivering innovative, high-performance computing solutions across data center, AI, and advanced packaging technologies.

We are seeking a highly experienced Package Design Engineer to support complex package design execution. This role requires a self-driven technical expert who thrives in a fast-paced, dynamic, and high-pressure environment, and can deliver high-quality designs with speed, precision, and scalability.

The successful candidate will play a key role in advancing AMD’s packaging methodologies by leveraging AI-driven design techniques, automation, and next-generation workflows to address the increasing complexity of heterogeneous integration and advanced packaging architectures.

THE PERSON:

The ideal candidate is an experienced package or silicon physical designer who:

• Demonstrates strong ownership and accountability across multiple programs
• Excels in fast-phase execution environments with competing priorities
• Applies AI/ML and automation to improve design productivity and quality
• Operates with minimal supervision while influencing cross-functional teams
• Balances deep technical expertise with strong collaboration and communication skills

KEY RESPONSIBILITIES:

Design Execution & Technical Leadership

• Lead end-to-end package design execution for complex products, ensuring performance, cost, quality, and schedule targets are met
• Handle multiple concurrent design programs in a fast-paced and high-pressure environment
• Develop substrate layouts, bump maps, and interposer designs for advanced packaging (2.5D/3D, chiplet-based architectures)
• Drive design decisions through close collaboration with SI/PI, mechanical, and SOC teams

Cross-Functional Collaboration

• Partner with internal engineering teams, OSATs, and substrate suppliers to deliver optimized solutions
• Interface with stakeholders to communicate design status, risks, and mitigation strategies
• Contribute to design reviews, signoff readiness, and tapeout processes

Methodology & Continuous Improvement

• Define and enhance package design methodologies, flows, and best practices
• Drive improvements in layout efficiency, reuse, and design standardization
• Mentor junior engineers and promote engineering excellence across the team

PREFERRED EXPERIENCE:

• Experience in designing complex substrate design or Silicon Bridge or Interposers
• Proven ability to execute in multi-project, fast-phased, and high-pressure environments
• Strong experience in advanced packaging technologies:
• Hands-on experience with EDA tools such as:
• Experience working with OSATs, foundries, and substrate vendors
• Solid understanding of Signal Integrity and Power Integrity fundamentals

ACADEMIC CREDENTIALS:

• Bachelor’s or higher degree in Electrical Engineering, Computer Engineering, or related field