Snr Engineer/Engineer, Thin Film PVD Process

Vanguard International Semiconductor Corporation; Singapore; On-site; SGD 90,000 - 130,000; Full time

Job summary

Vanguard International Semiconductor Corporation is seeking a Snr Engineer/Engineer for Thin Film PVD processes. You will analyze SPC charts, perform DOE and yield data analysis, and create process controls across modules.

You will lead small cross-functional teams to resolve yield excursions and drive improvements. The role requires 2+ years in wafer fabrication and Thin Film PVD, strong analytical skills, and the ability to work under pressure in a fast-paced environment.

Qualifications

• Degree required in Electrical/Electronics/Microelectronics/Chemical Process/Chemistry/Physics/Material Sciences/Mechanical
• Min 2 years of Wafer Fabrication process and Thin Film PVD experience
• Excellent communication and documentation skills
• Able to work in a fast-paced environment and take ownership

Responsibilities

• Analyze SPC charts using SPACE; apply PR rules, annotate for SPC OOC troubleshooting, and monitor Cp/Cpk indices
• Analyze split lots, DOE, ET, and sort yield data using JMP and Klarity ACE
• Create SPC charts and DCOP; modify SLDB using PROMIS (Si-View)
• Upload, verify, and ensure recipe compliance using RMS
• Follow up on SPSR, MRB, 8D, TECN, and spec updates; guide junior engineers
• Set up and troubleshoot recipes/job files across metrology tools in the module
• Analyze engineering data to identify chronic process issues and lead improvement programs; establish CAS/procedures and coordinate cross-department resolution
• Collaborate with Equipment and Manufacturing to meet module objectives and drive uptime and OEE
• Lead small cross-functional teams to resolve yield excursions and drive yield improvement
• Initiate and support CIP programs to optimize process window, yield, cost, and productivity; improve process capability
• Resolve complex technical and yield-related issues within the module
• Support cross-fab benchmarking to adopt best practices across fabs
• Conduct self-audits and update specifications/documentation to meet TS16949 quality standards

Skills

Teamwork

Analytical thinking

Written communication

Interpersonal skills

MS Office proficiency

Education

Electrical/Electronics/Microelectronics/Chemical Process/Chemistry/Physics/Material Sciences/Mechanical degree

Tools

JMP

Klarity ACE

PROMIS (Si-View)

RMS

SPACE

Job description

Snr Engineer/Engineer, Thin Film PVD Process (Ref: 250700124)

• Analyze SPC charts using SPACE; apply PR rules, perform proper annotations for SPC OOC troubleshooting, and monitor Cp/Cpk indices.
• Analyze split lots, DOE, ET, and sort yield data using JMP and Klarity ACE.
• Create SPC charts and DCOP; modify SLDB using PROMIS (Si-View).
• Upload, verify, and ensure recipe compliance using RMS.
• Follow up on SPSR, MRB, 8D, TECN, and spec updates (ECN); provide guidance to junior engineers.
• Set up and troubleshoot recipes/job files across all metrology tools within the module.
• Analyze engineering data to identify chronic process issues and lead improvement programs; establish CAS/procedures and coordinate cross-department resolution.
• Collaborate with Equipment and Manufacturing teams to meet module objectives and drive uptime and OEE targets.
• Lead small cross-functional teams to resolve yield excursions and drive yield improvement.
• Initiate and support CIP programs to optimize process window, yield, cost, and productivity; improve process capability.
• Resolve complex technical and yield-related issues within the module.
• Support cross-fab benchmarking to adopt best practices across fabs.
• Conduct self-audits and update specifications/documentation to meet TS16949 quality standards.

Requirements

• Degree in Electrical / Electronics / Microelectronics / Chemical Process / Chemistry / Physics / Material Sciences / Mechanical
• Min 2 years of relevant work experience in Wafer Fabrication process and Thin Film PVD Process.
• An excellent team player with good interpersonal, communication and written skills
• Strong logical thinking capability and good analytical skill
• Highly committed with good ownership and accountability
• Able to adapt in a fast-paced environment and work under pressure
• Proficient in MS Office Applications

We regret that only shortlisted candidates will be notified.