Senior Engineer/Engineer, Thin Film Equipmemt

Vanguard International Semiconductor Corporation; Singapore; On-site; SGD 90,000 - 120,000; Full time

Job summary

Vanguard International Semiconductor Corporation is seeking a Senior Engineer/Engineer for Thin Film Equipment to own, improve, and sustain KPI-driven maintenance and process improvements in wafer fabrication.

The role emphasizes leadership, mentorship, and collaboration with process and manufacturing teams to ensure module objectives are met while controlling costs and uptime.

Qualifications

• Degree in Electrical / Electronics / Mechanical / Mechatronics / Microelectronics Engineering.
• Min 3 years in wafer fabrication with Thin Film Equipment (CVD/PVD).
• Strong team player with good interpersonal, communication and written skills.
• High level of integrity with strong leadership attributes to lead and coach a team.
• Able to adapt in a fast pace environment and work under pressure.
• Proficient in MS Office Applications.

Responsibilities

• Own, maintain and improve quality, uptime and cost indices.
• Sustain equipment KPI and drive continuous improvements.
• Coordinate with process and manufacturing Engineers to meet module objectives.
• Manage logistics for parts to prevent uptime losses.
• Plan and implement an effective Preventive Maintenance program.
• Coach and mentor subordinates; provide feedback on performance.
• Document Corrective Action and Best Known Methods for ROI learning.
• Participate in CIP programs to optimise equipment utilization and cost of maintenance.
• Coordinate new equipment start-up to support production.
• Wafer scrap reduction awareness and mindset.
• Follow up on SPSR, MRB, 8D, TECN, and ECN closures; guide juniors.

Skills

Team player

Interpersonal skills

Communication skills

Written skills

Analytical thinking

Leadership

Ownership & accountability

Adaptability

MS Office

Education

Electrical / Electronics / Mechanical / Mechatronics / Microelectronics Engineering

Tools

JMP

PROMIS (SiView)

SPC charts

Job description

Senior Engineer/Engineer, Thin Film Equipmemt (Ref: 260800182)

To own, maintain and improve the following indices: Quality, Uptime and Cost.

Sustain equipment KPI and make continuous improvements to enhance the performance.

Monitor and control equipment performance indices. Optimize PM procedures to make it more effective and efficient.

Coordinate with both process and manufacturing Engineers to ensure work is carried out efficiently to meet module objectives.

Manage the logistics for parts so as to prevent prolonged uptime losses in the case of equipment failure.

Manage the expenditure allocated for equipment maintenance without compromising on quality output.

Continuous improvement of equipment KPI in terms of quality, uptime and costs.

Plan and implement an effective Preventive Maintenance program on equipment.

Coach and Mentor subordinates to ensure that skill level and knowledge are up to date, and continuously give feedback on their work performance.

Document Corrective Action and Best Known Methods, and Fan it out to all for maximum ROI and learning.

Participate in CIP programs to optimize equipment utilization and cost of maintenance.

Become the technical Expert for the respective machine specialization.

Monitor and analyze SPC charts. Know how to use JMP to analyze engineering experiments.

Know how to use measurement instruments effectively in data collection.

Understand FMEA and be able to generate FMEA analysis for new tool. Able to utilize it to identify tool weaknesses and derive the top 3 to 5 risk factors.

Able to create PROMIS (SiView) DC OP and SPC charts.

Coordinate new equipment start-up to support production, from facilities hookup, vendor startup, to acceptance of equipment for production.

Wafer scrap reduction awareness and mindset.

Follow up on SPSR, MRB, 8D, TECN, and ECN documentation for closure of issues / events. Provide guidance

to Junior Engineers.

Self audit and update specifications to meet TS16949 Quality Standard requirements.

Set Expectation and carry out performance appraisal for Technician or AE as instructed by

Section Manager.

Requirements:

• Degree in Electrical / Electronics / Mechanical / Mechatronics / Microelectronics Engineering
• Min3 years of relevant work experience Wafer fabrication and experience inhandlingThin Film Equipment (CVD/PVD).
• Goodteam player with good interpersonal, communication and written skills
• Strong logical thinking capability and good analytical skill
• High level of integrity with strong leadership attributes to lead and coach a team
• Highly committed with good ownership and accountability
• Able to adapt in a fast pace environment and work under pressure
• Proficient in MS Office Applications

We regret that only shortlisted candidates will be notified.