Senior Engineer/Engineer (Thin Film - CMP Process)

vanguard international semiconductor singapore pte. ltd.; Singapore; On-site; SGD 70,000 - 110,000; Full time

Job summary

Vanguard International Semiconductor Singapore Pte. Ltd. invites engineers with a background in Thin Film CMP processes to join our module team. You will analyze SPC data, optimize processes, lead improvement projects and coach junior engineers to achieve uptime and OEE targets.

Responsibilities cover recipe validation, data analysis, cross-functional collaboration with Equipment and Manufacturing teams, and adherence to TS16949 quality standards.

Qualifications

• Degree in Electrical/Electronics/Microelectronics or Chemical/Physics/Materials Science/Mechanical.
• Min 2 years of relevant work experience in Thin Film CMP Process.
• Knowledge of wafer fabrication processes.
• Excellent teamwork, interpersonal, communication and writing skills.
• Strong analytical thinking and integrity with leadership to coach a team.

Responsibilities

• Analyze SPC charts and apply SPACE rules; annotate to maintain quality troubleshooting rate for SPC OOC.
• Analyze split lot, DOE data, ET, sort yield using JMP, Klarity ACE.
• Create SPC charts, DCOP and modify SLDB using PROMIS (Si-View).
• Upload recipe, check recipe and ensure recipe content compliance using RMS.
• Follow up on SPSR, MRB, 8D, TECN, or spec updates with ECN; provide guidance to junior Engineers.
• Setup and troubleshoot issues in recipes/ job files in all metrology tools within the Module.
• Analyze data from passed down to identify chronic process issues, establish improvement programs and lead engineers to resolve them.
• Work as a team with both Equipment and Manufacturing Engineers to meet Module objectives; drive uptime and OEE.
• Take on leadership roles to drive a small cross functional task team to address yield improvement/ excursion issues.
• Facilitate/ initiate CIP programs to optimize process window, cost, yield, and productivity.
• Resolve complex technical issues in own Module or yield related issues.
• Follow up with cross-fab benchmarking activities to engage best-in-campus practices across fabs.
• Self audit and update specifications / documentation to meet TS16949 Quality Standard requirements.

Job description

Job Responsibilities:

• Analyze SPC charts using SPACE. Know all the PR rules and their significance. Do proper annotation to maintain quality troubleshooting rate for SPC OOC. Understand Cp and Cpk indices.
• Analyze split lot, DOE data, ET, sort yield using JMP, Klarity ACE.
• Create SPC charts, DCOP and modify SLDB using PROMIS (Si-View).
• Upload recipe, check recipe and ensure recipe content compliance using RMS.
• Follow up on SPSR, MRB, 8D, TECN, or spec update with ECN. Provide guidance to junior Engineers.
• Setup and troubleshoot issues in recipes/ job files in all metrology tools within the Module.
• Analyze data from passed down to identify chronic process issues, establish improvement programs and lead engineers to resolve them. Establish CAS / procedures to be followed and work with other departments for resolution if required.
• Work as a team with both Equipment and Manufacturing Engineers to meet Module objectives. Drive team to meet key indices of Uptime and OEE as per the goals set for these indices.
• Take on leadership roles to drive a small cross functional task team to address yield improvement/ excursion issues.
• Facilitate/ initiate CIP programs to optimize process window, cost, yield, and productivity. Establish plans and strategies to optimize process capability to meet operational requirements.
• Resolve complex technical issues in own Module or yield related issues
• Follow up with cross-fab benchmarking activities to engage the best-in-campus practices across fabs.
• Self audit and update specifications / documentation to meet TS16949 Quality Standard requirements.

Requirements:

• Degree in Electrical / Electronics / Microelectronics / Chemical Process / Chemistry / Physics / Material Sciences / Mechanical
• Min 2 years of relevant work experience in Thin Film CMP Process.
• Knowledge in Wafer fabrication process.
• An excellent team player with good interpersonal, communication and written skills
• Strong logical thinking capability and good analytical skill
• High level of integrity with strong leadership attributes to lead and coach a team
• Highly committed with good ownership and accountability
• Able to adapt in a fast pace environment and work under pressure
• Proficient in MS Office Applications