Principal Engineer / Senior Engineer (Thin Film CVD - Process)

Vanguard International Semiconductor Corporation (VIS); Singapore; On-site; SGD 70,000 - 100,000; Full time

Job summary

Vanguard International Semiconductor Corporation (VIS) is seeking a seasoned engineer to manage wafer fabrication processes, analyse SPC charts, and lead improvement projects focusing on OOC reduction and CPK enhancement.

You will monitor critical SPC metrics daily, conduct DOE studies, and work with equipment and manufacturing teams to optimize tool matching, process windows, and yield. Strong leadership and communication are essential.

Qualifications

• Must have strong leadership and mentoring abilities.
• Excellent interpersonal and written communication skills.
• Analytical thinking with data-driven decision making.
• Proactive, responsible, and able to lead cross-functional teams.

Responsibilities

• Analyse SPC charts and maintain quality troubleshooting rate for SPC OOC.
• Monitor critical SPC charts daily and propose improvements to reduce OOC and improve CPK.
• Drive process window studies, DOE analysis, and yield optimization.
• Collaborate with Equipment and Mfg. Engineers to meet module objectives and OEE goals.
• Prepare and update process documentation and ensure compliance with TS16949 quality standards.

Skills

Leadership

Teamwork

Analytical skills

Communication

Education

Electrical / Electronics / Mechanical / Microelectronics / Chemical Process / Chemistry / Physics / Material Science / Material Engineering

Tools

MS Office

Job description

Job Description

• Analyse SPC chart. Know all the PR rules and their significance. Do proper annotation to maintain quality troubleshooting rate for SPC OOC. Understand Cp and Cpk indices
• Monitor critical SPC charts daily. Perform process window study and provide improvement plan to reduce OOC and improve CPK
• Analyse split lot, DOE data, ET, sort yield using JMP, Klarity ACE.
• Create SPC charts, DCOP and modify SLDB using PROMIS (Si-View).
• Upload recipe, check recipe and ensure recipe content compliance using RMS.
• Follow up on SPSR, MRB, 8D, TECN, or spec update with ECN.
• Setup and troubleshoot in recipes/ job files in all metrology tools within the Module.
• Follow up on pass down to troubleshoot process issues. Establish CAS / procedures to be followed and work with other departments for resolution if required.
• Startup and qualify new process and new equipment within scheduled timeline. Work closely with the Equipment Engineer on new equipment acceptance. Know the concept of repeatability and reproducibility (R&R) run.
• Work on reducing process constraint so that Mfg. can have more flexibility.
• Perform process matching between equipment’s to reduce variation and analysis / DOE to find factors for better tool matching.
• Participate in CIP programs to optimize process window, cost, yield, and productivity.
• Work as a team with both Equipment and Mfg. Engineers to meet Module objectives. Work to meet the key indices of Uptime and OEE goals.
• Represent own Module to attend cross-functional task team to address yield improvement/ excursion issues. Follow up with cross-fab benchmarking activities to engage the best-in-campus practices across fabs.
• Self-audit and update specifications/ documentation to meet TS16949 Quality Standard requirements.
• Follow good housekeeping and safety rules in office and FAB.
• Provide feedback/ training to AEs or Techs on their troubleshooting skills, understanding of processes, decision making, risk assessment.

Requirements

• Degree in Electrical / Electronics / Mechanical /Microelectronics / Chemical Process / Chemistry / Physics/ Material Science/Material Engineering
• Min 5 years of relevant work experience in Wafer fabrication process and Thin Film CVD Process.
• An excellent team player with good interpersonal, communication and written skills
• Strong leadership capability to lead and guide junior engineers
• Strong logical thinking capability and good analytical skill
• High level of integrity with strong leadership attributes to lead and coach a team
• Proactive and highly committed with good ownership and accountability
• Able to adapt in a fast-paced environment and work under pressure
• Proficient in MS Office Applications