Senior Staff Engineer / Principal Engineer Automotive Package Concepts

Infineon Technologies AG; Singapore; On-site; SGD 120,000 - 180,000; Full time

Job summary

Infineon Technologies AG in Singapore seeks an Automotive Package Concepts Engineer to translate automotive needs into package platform requirements and drive cross-functional development across global teams.

You will lead feasibility studies, coordinate with BU/QM/project teams, and identify opportunities with new packaging technologies while providing roadmap inputs to ATV. Fluency in English and strong collaboration are essential.

Qualifications

• Degree in electrical/electronics engineering, material science, or physics.
• 5+ years of experience in semiconductor or automotive industry.
• Experience with package concepts and BOM considerations (QFN/QFP/laminate).
• Proven leadership and cross-functional teamwork abilities.
• Strong communication and presentation skills in English.

Responsibilities

• Understand and translate automotive needs into package platform requirements.
• Align and harmonize requirements across stakeholders and teams.
• Lead feasibility studies and pre-development projects for package solutions.
• Provide roadmap inputs to ATV and act as primary contact for package topics.

Skills

Cross-functional collaboration

Technical leadership

Effective communication

Problem-solving

English proficiency

Education

Electrical engineering

Materials science

Physics

Job description

#WeAreIn for jobs that impact everyone's life.Build the future nobody’s dreamed of yet... are you ready to rethink the impossible?As an Automotive Package Concepts Engineer on our Research & Development team, you'll have the opportunity to merge creativity with your technical expertise by shaping the future of technology, driving groundbreaking projects, and bringing new ideas to life.Are you in?Your roleKey responsibilities in your new roleUnderstand and translate automotive application and product needs, including mid/long-term aspects, into package platform requirementsChallenge, align, and harmonize requirements across all stakeholdersTrigger and follow up on feasibility studies, innovation, and pre-development projects for package solutionsAssess and propose project complexity in close cooperation with package development teams, aligning all technical, cost, and quality aspects with BU, QM, and project teamsConduct continuous market screening of competitor and subcontractor package portfolios in cooperation with Reverse EngineeringIdentify business opportunities enabled by new packaging technologies and concepts together with Application EngineeringProvide automotive package platform roadmap inputs to OSAT, BE package roadmap, and FE/BE unit process roadmap, and serve as the primary contact for all package-relevant topics within ATVYour profileQualifications and skills to help you succeedDegree in electrical/electronics engineering, material science, or physics5+ years of experience in the semiconductor or automotive industryDeep understanding of QFN, QFP, and/or laminate package BoM construction, materials, and related production methods/processesTechnical leadership with strong problem-solving and decision-making skills through team collaboration, managing technical challenges in an open, cooperative, and proactive mannerExperience working with cross-functional international teams, especially in AsiaEffective communication and presentation skills, with the ability to engage major stakeholdersFluent in English#WeAreIn for driving decarbonization and digitalization.As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener.Are you in?We are on a journey to create the best Infineon for everyone.We strive to create the best Infineon for everyone by embracing diversity and inclusion. We welcome applicants for who they are and offer a workplace built on trust, openness, respect and equal opportunity.Our hiring decisions are based on skills and experience. Even if you don’t meet every requirement, we encourage you to apply.Please let your recruiter know if you need any accommodations during the interview process.Learn more about our various contact channels and about Diversity & Inclusion at Infineon.Sherlene Ong