Senior Staff Engineer / Principal Engineer Automotive Package Concepts

Infineon Technologies; Singapore; On-site; SGD 90,000 - 150,000; Full time

Job summary

Infineon Technologies in Singapore is seeking an Automotive Package Concepts Engineer to shape the future of power electronics packaging. You will translate automotive needs into platform requirements and lead cross-functional teamwork across BU, QM, and project teams.

You bring a degree in electrical engineering or related field, 5+ years in semiconductor or automotive packaging, and fluent English. The role involves market screening, feasibility studies, and providing roadmaps to OSAT and BE

Qualifications

• Degree in electrical/electronics engineering, materials science, or physics.
• 5+ years of experience in the semiconductor or automotive industry.
• Fluent in English.

Responsibilities

• Translate automotive application and product needs into package platform requirements.
• Align, harmonize requirements across stakeholders.
• Lead feasibility studies, innovation, and pre-development projects for package solutions.
• Assess project complexity with package development teams, balancing technical, cost, and quality aspects.

Education

Electrical/electronics engineering

Materials science

Physics

Job description

#WeAreIn for jobsthat impact everyone's life.

Build the futurenobody’s dreamed of yet... are you ready to rethink the impossible?

As an Automotive Package Concepts Engineer on ourResearch & Development team, you'll have the opportunity to mergecreativity with your technical expertise by shaping the future of technology,driving groundbreaking projects, and bringing new ideas to life.

Are you in?

Your role

Key responsibilities in your new role

• Understand and translate automotive application and product needs, including mid/long-term aspects, into package platform requirements
• Challenge, align, and harmonize requirements across all stakeholders
• Trigger and follow up on feasibility studies, innovation, and pre-development projects for package solutions
• Assess and propose project complexity in close cooperation with package development teams, aligning all technical, cost, and quality aspects with BU, QM, and project teams
• Conduct continuous market screening of competitor and subcontractor package portfolios in cooperation with Reverse Engineering
• Identify business opportunities enabled by new packaging technologies and concepts together with Application Engineering
• Provide automotive package platform roadmap inputs to OSAT, BE package roadmap, and FE/BE unit process roadmap, and serve as the primary contact for all package-relevant topics within ATV

Your profile

Qualifications and skills to help you succeed

• Degree in electrical/electronics engineering, material science, or physics
• 5+ years of experience in the semiconductor or automotive industry
• Deep understanding of QFN, QFP, and/or laminate package BoM construction, materials, and related production methods/processes
• Technical leadership with strong problem-solving and decision-making skills through team collaboration, managing technical challenges in an open, cooperative, and proactive manner
• Experience working with cross-functional international teams, especially in Asia
• Effective communication and presentation skills, with the ability to engage major stakeholders
• Fluent in English

#WeAreIn for driving decarbonization and digitalization.As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener.Are you in?

We are on a journey to create the best Infineon for everyone.

We strive to create the best Infineon for everyone by embracing diversity and inclusion. We welcome applicants for who they are and offer a workplace built on trust, openness, respect and equal opportunity.

Our hiring decisions are based on skills and experience. Even if you don’t meet every requirement, we encourage you to apply.

Please let your recruiter know if you need any accommodations during the interview process.

Learn more about our variouscontact channelsand aboutDiversity & Inclusionat Infineon.

Sherlene Ong