Internship - Package Concept Team

Infineon Technologies AG; Singapore; In loco; SGD 16.740 - 23.436; Part-time

Descrizione del lavoro

Infineon Technologies AG in Singapore offers a packaging design internship. You will analyze datasets, understand electrical/structural packaging criteria, and develop a dashboard for package selection while building an app for package information retrieval.

You will collaborate with a global team, gain exposure to advanced packaging concepts, and prepare for a fast-paced product launch environment in automotive and IoT contexts.

Competenze

• Education in engineering with interest in packaging or semiconductor tech.
• Analytical mindset with ability to handle complex datasets.
• Exposure to AI, digitalisation or programming is a plus.
• Proactive, adaptable and self-motivated with good organization.

Mansioni

• Understand package criteria electrically, structurally and quality standards.
• Analyze large datasets to inform package concepts for decision-making.
• Collect, clean and organize data from multiple sources for analysis.
• Develop a dashboard for package selection and build a package information app.

Conoscenze

Analytical capability

Digital programming exposure

Initiative & adaptability

Self-management

Semiconductor fundamentals

Formazione

Bachelor's/Master's pursuing engineering studies

Strumenti

Dashboard development

Mobile app development

Descrizione del lavoro

The student, gets to work with our global team on package design and selection process. He/she will work to analyse and make digitalisation of the package assembly database. Student will also spearhead the platform to enable good selection of package for efficient customer design acceptance and build an application for package information and analysis.

Your Role

Key responsibilities in your new role

• Package Requirements Understanding: Understand the criteria in a package, electrically, structurally, quality standard governing the application.
• Data Analysis: Conduct in-depth analysis of large and complex datasets to extract meaningful package concept in technology & assembly for decision-making.
• Data Collection & Organization: Collect, clean, and organize data from various sources for analysis.
• Dashboard Development: Work on a dashboard for package selection.
• App Development: Build a handphone app for package info retrieval.

Internship Learning Outcomes:

• Advanced Packaging Concepts: Concept and design of advanced packaging in specific automotive solutions.
• End-to-End Product Exposure: Experience the fast pace and dynamic conceptualisation of a package from design to ramp up phase.
• Global Team Collaboration: Exposure to various expert team and the team work to realise a final product in a global setting.
• Career Preparation: Integrate into new package design and launch in the competitive packaging assembly environment.

Your Profile

Qualifications and skills to help you succeed

• Education: Bachelor's/ Masters' pursuing engineering studies.
• Semiconductor Fundamentals: Basic technical understanding of semiconductor material / process / technology.
• Analytical Capability: Experience with complex dataset, with good analytical mindset.
• Digital/Programming Exposure: Academic exposure in AI, digitalisation or programming languages (preferred).
• Initiative & Adaptability: Able to handle changes, take initiative to make solution proposal.
• Self-Management: Self motivated, highly organised, able to manage task independently.
• Preferred Intake: Jan 27 - May/June 27.

Contact:

Hillary Woo

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