Senior SMT Process Engineer – High-Complexity BGA PCBs

AMD; Singapore; Hybrid; SGD 120,000 - 180,000; Full time

Job summary

AMD in Singapore seeks a senior SMT and board-assembly process expert to define advanced assembly strategies for high‑complexity computing platforms. You will lead end‑to‑end SMT development, drive warpage‑critical BGA packaging, and collaborate with EMS partners to ensure robust, scalable manufacturing.

You will use data and engineering judgment to solve non‑standard assembly problems across package, PCB, and thermal systems, while communicating clearly to diverse audiences.

Qualifications

• Extensive hands-on SMT process development for high‑complexity PCB assemblies.
• Proven experience with large BGAs and high warpage measurement methods.
• Familiar with DOE, RCA, and statistical analysis tools.

Responsibilities

• Lead end-to-end SMT process development (stencil/printing, placement, reflow, post-reflow).
• Own assembly of large, high-warpage BGA packages and derive design rules and process controls.
• Reduce solder defects via stencil design, paste/flux selection and reflow optimization.
• Define edge bonding and underfill strategies to improve board reliability.
• Evaluate mechanical stress transfer to solder joints and qualify post-SMT rework processes.
• Lead DFM reviews and publish board-assembly guidelines for EMS partners.
• Run DOEs and root-cause analyses for yield and reliability improvements.
• Collaborate with contract manufacturers, material suppliers and equipment vendors.

Skills

SMT process dev

BGA warpage analysis

DOE & RCA

IPC/J-STD standards

Cross-functional work

Education

Bachelor's or Master’s in Manufacturing/Mechanical Engineering or Materials Science

Tools

Mentor Graphics

Cadence Allegro

Pentalogix

Job description

AMD in Singapore seeks a senior SMT and board-assembly process expert to define advanced assembly strategies for high‑complexity computing platforms. You will lead end‑to‑end SMT development, drive warpage‑critical BGA packaging, and collaborate with EMS partners to ensure robust, scalable manufacturing.

You will use data and engineering judgment to solve non‑standard assembly problems across package, PCB, and thermal systems, while communicating clearly to diverse audiences.