Advanced SMT Process Development Engineer

AMD; Singapore; Hybride; SGD 120 000 - 180 000; Plein temps

Résumé du poste

AMD in Singapore seeks a senior SMT and board-assembly process expert to define advanced assembly strategies for high‑complexity computing platforms. You will lead end‑to‑end SMT development, drive warpage‑critical BGA packaging, and collaborate with EMS partners to ensure robust, scalable manufacturing.

You will use data and engineering judgment to solve non‑standard assembly problems across package, PCB, and thermal systems, while communicating clearly to diverse audiences.

Qualifications

• Extensive hands-on SMT process development for high‑complexity PCB assemblies.
• Proven experience with large BGAs and high warpage measurement methods.
• Familiar with DOE, RCA, and statistical analysis tools.

Responsabilités

• Lead end-to-end SMT process development (stencil/printing, placement, reflow, post-reflow).
• Own assembly of large, high-warpage BGA packages and derive design rules and process controls.
• Reduce solder defects via stencil design, paste/flux selection and reflow optimization.
• Define edge bonding and underfill strategies to improve board reliability.
• Evaluate mechanical stress transfer to solder joints and qualify post-SMT rework processes.
• Lead DFM reviews and publish board-assembly guidelines for EMS partners.
• Run DOEs and root-cause analyses for yield and reliability improvements.
• Collaborate with contract manufacturers, material suppliers and equipment vendors.

Connaissances

SMT process dev

BGA warpage analysis

DOE & RCA

IPC/J-STD standards

Cross-functional work

Formation

Bachelor's or Master’s in Manufacturing/Mechanical Engineering or Materials Science

Outils

Mentor Graphics

Cadence Allegro

Pentalogix

Description du poste

ADVANCE YOUR CAREER. ADVANCE THE WORLD.

At AMD, we believetechnology has the power to solve the world’s most important challenges. From advancing healthcare and scientific discovery to powering AI and the technologies people rely on every day, innovation at AMDis shapingthefuture.

Whetheryou’redesigning next-gen processors, enabling AI breakthroughs, orbringing leading edge products to market, every role at AMD contributes to something bigger— technologythat moves the world forward.Join us and, together, we’ll advance your career.

THE ROLE:

You will be AMD's senior technical expert for advanced SMT and board-assembly process development on high-complexity computing platforms. You will define assembly strategies, influence product design, and make complex PCB assemblies manufacturable, especially those with large BGA packages and significant warpage and coplanarity challenges. Your work will set the standards that manufacturing partners use worldwide.

THE PERSON:

You are a hands-on technical authority who solves non-standard assembly problems using data and engineering judgment. You influence decisions across package, PCB, thermal/mechanical, reliability and manufacturing teams without direct people management, and you communicate complex topics clearly to different audiences.

KEY RESPONSIBILITIES:

• Lead end-to-end SMT process development (stencil/printing, placement, reflow, post-reflow) and define robust process windows for yield, reliability and scale.
• Own assembly of large, high-warpage BGA packages. Turn warpage, coplanarity and thermal data into design rules, process controls and board-support/fixture concepts.
• Reduce solder defects (insufficient solder, head-in-pillow, bridging, voiding) through stencil design, paste/flux selection and reflow optimization, including vacuum and inert-atmosphere reflow.
• Define and qualify edge bonding and underfill strategies to improve mechanical shock, vibration and board-level reliability. Develop manufacturable processes for integrating mechanical and thermal hardware (heatsinks, clamping, thermal interface materials).
• Evaluate how mechanical stress transfers to solder joints. Make sure post-SMT and controlled BGA rework processes are repeatable, auditable and meet reliability requirements.
• Lead DFM reviews (land patterns, via-in-pad, solder mask, keep-outs), and author board-assembly guidelines and BKMs for internal teams and EMS partners.
• Run DOEs and root-cause analysis for complex yield and reliability issues. Evaluate new technologies such as low-temperature solder, micro spring/spacer and removable-lid concepts.
• Work with contract manufacturers, material suppliers and equipment vendors to qualify capability and drive improvements.

PREFERRED EXPERIENCE:

• Extensive hands-on SMT process development for high-complexity PCB assemblies, from engineering builds to high-volume manufacturing.
• Proven experience with large BGAs (>70 mm) and high warpage (~400–500 µm), including warpage measurement (Shadow Moiré, DIC) and inspection (X-ray, C-SAM).
• Strong DOE, statistical and root-cause analysis skills (Minitab, JMP or equivalent).
• Knowledge of IPC/J-STD standards and board-level reliability qualification (temperature cycling, vibration, mechanical shock, failure analysis).
• Experience working with global EMS partners and equipment vendors.
• Familiarity with PCB CAD tools (Mentor Graphics, Cadence Allegro or Pentalogix) for DFM review.

ACADEMIC CREDENTIALS:

• Bachelor's or Master's degree in Manufacturing Engineering, Mechanical Engineering, Materials Science or a related discipline.

LOCATION:

Singapore

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Benefits offered are described: AMD benefits at a glance.

AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.

AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here.

This posting is for an existing vacancy.