Scientist (Heterogeneous Integration), IME

A*STAR - Agency for Science, Technology and Research; Singapore; Hybrid; SGD 80,000 - 120,000; Full time

Job summary

A leading research institute in Singapore is seeking a passionate Principal Scientist to join their Heterogeneous Integration Department. This role focuses on advancing hybrid bonding processes and developing fabrication techniques for 2.5D and 3D packaging applications. The ideal candidate will have a PhD in a relevant field and experience with microelectronics. Responsibilities include collaborating on technology roadmaps, leading projects, and mentoring talents. If you have strong problem-solving skills and technical expertise in hybrid bonding, consider applying for this exciting opportunity.

Qualifications

• 0 to 5 years of experience in microelectronic devices, circuits, and hybrid component integration.
• Knowledge in hybrid bonding or flip chip bonding is plus.
• Strong analytical skills and proficiency in data analysis.

Responsibilities

• Collaborate with senior staff and external partners on technology roadmaps.
• Lead high-impact projects and mentor less experienced colleagues.
• Research and develop advanced packaging technology.

Skills

Hybrid bonding knowledge

Problem-solving skills

Data analysis

Collaboration

Education

PhD in Materials Science and Engineering or related field

Tools

Hybrid bonding equipment technologies

Job description

Job Description

Scientist/Senior Scientist – Process Integrator / Hybrid Bonding/ Heterogeneous Integration The Heterogeneous Integration Department at the Institute of Microelectronics (IME) is seeking a passionate and skilled Principal Scientist to join our team. This role is pivotal in advancing state‑of‑the‑art chip‑to‑wafer and wafer‑to‑wafer hybrid bonding processes, developing cutting‑edge fabrication techniques for 2.5D and 3D packaging applications, and conducting electrical and reliability characterisation. The position provides an exciting opportunity to contribute to groundbreaking technologies and collaborate with a dynamic team of researchers and external stakeholders.

Key Responsibilities

• Collaborate with senior staff, process integrators, and external partners to address technology roadmaps, process capability requirements, and business challenges.
• Lead high‑impact projects with manageable risks and mentor less experienced colleagues.
• Conceive and plan projects involving new materials, advanced process integration approaches, and innovative concepts.
• Research and develop advanced packaging technology such as flip‑chip & hybrid bonding techniques for 2.5D and 3D IC applications.
• Investigate and refine wafer bonding processes for interposer fabrication, inter‑dielectric gap fill, and alignment accuracy, addressing critical factors such as warpage, bonding strength, and yield.
• Optimise die bonding processes, including the selection of low‑temperature organic and inorganic bonding materials, surface preparation, and bonding methods.
• Conduct engineering experiments for process characterisation to drive quality and yield improvements.
• Perform reliability characterisation of hybrid‑bonded packages to ensure robustness and long‑term performance.
• Act as a subject matter expert (SME) for both internal and external stakeholders, providing guidance and expertise.
• Inspire and mentor talents in semiconductor technology, contributing to workforce development in the field.
• Work with minimal supervision and should be a team player.

Qualifications and Skills

• Educational Background: PhD in Materials Science and Engineering, Mechanical or Chemical Engineering, Electronics, Electrical and Computer Engineering, or a related field.
• Experience: 0 to 5 years of experience in microelectronic devices, circuits, and hybrid component integration, 2.5D/3D heterogeneous integration applications.
• Technical Expertise: knowledge in hybrid bonding or flip chip bonding is plus.
• Knowledge of hybrid bonding equipment technologies, bonding materials and methodologies, and reliability characterisation is preferable.
• Strong analytical and problem‑solving skills. Proficiency in data analysis and interpretation and design of experiments.
• Excellent written and verbal communication abilities.
• Teamwork: Ability to work collaboratively in a research‑oriented environment (OEMs, customers, and internal stakeholders). Demonstrated ability to manage multiple tasks and projects simultaneously.
• Demonstrated expertise in heterogeneous integration, hybrid bonding, and advanced packaging processes.
• Proven ability to troubleshoot and resolve process‑related challenges.