Associate Engineer, Backgrind & Dicing Metrology

GlobalFoundries; Singapore; On-site; SGD 42,000 - 60,000; Full time

Job summary

GlobalFoundries in Singapore is seeking an Associate Engineer for Backgrind & Dicing to support critical wafer manufacturing processes. You will operate, monitor, and improve backgrinding and dicing, setting up equipment and controlling processes to reduce defects while adhering to safety and quality standards.

Collaborate with process and equipment engineers and cross-functional teams to troubleshoot issues and implement improvements.

Qualifications

• Diploma / ITE Hi-Nitec in Electrical/Electronic/Mechanical.
• Minimum 2 years working experience in electronic production environment, preferably from OSAT/assembly with experience in backgrind or dicing process.
• Must be able to work on 12 hours rotating shift.
• MS Office literate.
• SPC knowledge.

Responsibilities

• Support daily run of backgrind and dicing.
• Perform incoming and outgoing inspections.
• Perform laminating, taping/detaping, backgrind and dicing as per process requirements.
• Perform thickness measurement and enter data into SiView.
• Carry out equipment PM according to plan PM schedule.
• Key-in SPC data for all defined equipment critical parameters.
• Performs other duties as assigned.

Skills

MS Office literate

SPC knowledge

Education

Diploma / ITE Hi-Nitec (Electrical/Electronic/Mechanical)

Job description

GlobalFoundries in Singapore is seeking an Associate Engineer for Backgrind & Dicing to support critical wafer manufacturing processes. You will operate, monitor, and improve backgrinding and dicing, setting up equipment and controlling processes to reduce defects while adhering to safety and quality standards.

Collaborate with process and equipment engineers and cross-functional teams to troubleshoot issues and implement improvements.