Associate Equipment Engineer

STATS CHIPPAC MANAGEMENT PTE. LTD.; Singapore; On-site; SGD 42,000 - 66,000; Full time

Job summary

STATS ChipPAC is seeking an Associate Equipment Engineer in Singapore to enhance equipment performance, yield and quality while minimizing downtime and costs. The role focuses on line sustaining activities, problem solving, and collaboration with external vendors.

The candidate should have a Diploma in Mechanical Engineering and at least 2 years of experience in wafer bumping operations, with willingness to learn and adapt to machine modifications. Shift work may be required.

Qualifications

• Diploma in Mechanical Engineering or equivalent.
• Minimum 2 years of relevant experience in wafer bumping operations.
• Ability to work on 12 hours rotating shift if required.
• Willingness to learn and improve equipment knowledge and machine design through machine modification.

Responsibilities

• Perform line sustaining job function on set-up, conversion and equipment repair to support production loading.
• Develop creative and innovative solutions to problems with considerable initiatives and independent thoughts.
• Communicate with external vendors to resolve problems.
• Identify problems as well as areas for yield and quality improvements and develop methods to improve productivity and reduce manufacturing cost.
• Support Backend Operation Balldrop, Ballrepair, Reflow Oven ,SRD Cleaning , Prober Tester , AOI Inspection .

Skills

Wafer bumping operations

Education

Diploma in Mechanical Engineering

Job description

About us

STATS ChipPAC is a leading provider of semiconductor packaging and test services. We are committed to delivering innovative engineering solutions and maintaining excellence in manufacturing processes. Our team of skilled engineers and technicians work collaboratively to push the boundaries of what's possible in semiconductor technology, serving clients across diverse industries and markets worldwide.

About the role

We are looking for an Associate Equipment Engineer to improve equipment performance, yield and quality while minimizing downtime, maximizing OEE and reducing manufacturing costs.

Key responsibilities

• Perform line sustaining job function on set-up, conversion and equipment repair to support production loading.
• Develop creative and innovative solutions to problems with considerable initiatives and independent thoughts.
• Communicate with external vendors to resolve problems.
• Identify problems as well as areas for yield and quality improvements and develop methods to improve productivity and reduce manufacturing cost.
• Support Backend Operation Balldrop, Ballrepair, Reflow Oven ,SRD Cleaning , Prober Tester , AOI Inspection .

What we're looking for

• Diploma in Mechanical Engineering or equivalent.
• Minimum 2 years of relevant experience in wafer bumping operations.
• Ability to work on 12 hours rotating shift if required.
• Willingness to learn and improve equipment knowledge and machine design through machine modification.