Associate Equipment Engineer

STATS CHIPPAC PTE. LTD.; Singapore; On-site; SGD 42,000 - 66,000; Full time

Job summary

STATS ChipPAC PTE. LTD. in Singapore is seeking an Associate Equipment Engineer to improve equipment performance, yield and quality while minimizing downtime and reducing manufacturing costs.

You will support production loading with line sustaining activities and work on 12‑hour rotating shifts if required. The role involves vendor liaison and hands‑on modification to enhance equipment reliability. The ideal candidate has a Diploma in Mechanical Engineering or equivalent and at least 2 years of

Qualifications

• Diploma in Mechanical Engineering or equivalent is required.
• Minimum 2 years of relevant experience in wafer bumping operations.
• Ability to work on 12 hours rotating shifts if required.
• Willingness to learn and improve equipment knowledge and machine design through modification.

Responsibilities

• Perform line sustaining on set-up, conversion and equipment repair to support production loading.
• Develop solutions to problems with initiative and independent thinking.
• Communicate with external vendors to resolve problems.
• Identify yield and quality improvement opportunities and develop methods to reduce manufacturing cost.
• Support Backend Operation Balldrop, Ballrepair, Reflow Oven, SRD Cleaning, Prober Tester, AOI Inspection.

Skills

Shift work

Willingness to learn

Education

Diploma in Mechanical Engineering or equivalent

Tools

Machine modification

Job description

About us

STATS ChipPAC is a leading provider of semiconductor packaging and test services. We are committed to delivering innovative engineering solutions and maintaining excellence in manufacturing processes. Our team of skilled engineers and technicians work collaboratively to push the boundaries of what's possible in semiconductor technology, serving clients across diverse industries and markets worldwide.

About the role

We are looking for an Associate Equipment Engineer to improve equipment performance, yield and quality while minimizing downtime, maximizing OEE and reducing manufacturing costs.

Key responsibilities

• Perform line sustaining job function on set-up, conversion and equipment repair to support production loading.
• Develop creative and innovative solutions to problems with considerable initiatives and independent thoughts.
• Communicate with external vendors to resolve problems.
• Identify problems as well as areas for yield and quality improvements and develop methods to improve productivity and reduce manufacturing cost.
• Support Backend Operation Balldrop, Ballrepair, Reflow Oven ,SRD Cleaning , Prober Tester , AOI Inspection .

What we're looking for

• Diploma in Mechanical Engineering or equivalent.
• Minimum 2 years of relevant experience in wafer bumping operations.
• Ability to work on 12 hours rotating shift if required.
• Willingness to learn and improve equipment knowledge and machine design through machine modification.