As Senior/Principal NAND Module Process Integration Engineer in Micron Technology Inc.'s Singapore R&D department, you will design, develop, integrate, and implement innovative process solutions to improve next‑generation 3D NAND yield and quality while maintaining competitive cost and performance.
Key Responsibilities
- Identify and quantify key module deficiencies and technology gaps.
- Lead cross‑functional teams to address these issues.
- Improve current process flows and develop innovative solutions to meet product requirements and manufacturability.
- Develop or redefine CSPEC criteria for optimal product performance and drive activities to ensure manufacturing process capability.
- Coordinate activities at the manufacturing site to secure funding for experiments and conversions, and effectively communicate decisions to R&D, Product Engineering, and Manufacturing partners.
- Undertake development projects to evaluate and implement new integration schemes for alpha and derivative part types.
- Establish proof of concept for future tech nodes at the manufacturing facility.
- Lead presentations at quarterly yield summits and monthly program reviews, summarizing complex problems, explaining actions taken, and aligning R&D, Manufacturing, and senior management teams.
- Assist in the transfer of new technology from R&D to manufacturing, ensuring a successful ramp‑up and qualification.
- Support the transfer, documentation, and training of module fundamentals into manufacturing.
Required Experience & Knowledge
- BS, MS, or PhD in Electrical Engineering, Microelectronics, Chemical Engineering, Materials Science, or a related field.
- Minimum of 3 years of experience in the semiconductor industry in Process Integration and Yield Enhancement.
- Strong holistic end‑to‑end understanding of PI modules on new NAND technologies and related structural & electrical failure mechanisms.
- In‑depth knowledge and direct experience with non‑volatile memories (NAND) and a solid grasp of the NAND process flow, interaction of process & device, and common yield & reliability issues.
- Experience with R&D (e.g., HKMG) and transfer/manufacturing desirable.
- Proficiency in scripting/programming/engineering/business intelligence/Analytics software such as Python, SolidWorks, Tableau, Power BI, etc. is desirable.
- Passion for semiconductor technology and innovation.
- Strong analytical, data‑driven decision making, and process integration optimization skills.
- Excellent communication and cross‑functional collaboration skills.
- Committed to quality, continuous improvement, and able to thrive in a demanding, dynamic environment.
- Self‑motivated and self‑governing, able to work independently and travel to the US for extended periods for collaborative R&D.
Legal Notice
All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.