PRINCIPAL ENGINEER, NAND PI

1100 Micron SemiAsiaOP Pte Ltd; Singapore; On-site; SGD 80,000 - 120,000; Full time

Job summary

1100 Micron SemiAsiaOP Pte Ltd in Singapore is seeking a Principal Engineer for the NAND Module Process Integration Team. This role involves designing, developing, and implementing process solutions to enhance the yield and quality of 3D NAND products.

Ideal candidates should have experience in semiconductor technology, excellent problem-solving skills, and advanced education in a relevant field. Strong teamwork and communication abilities are essential. The position offers a dynamic work environment with opportunities for innovation and continuous improvement.

Qualifications

• Passionate about semiconductor technology and innovation.
• Adept at data analysis, problem-solving, and process integration optimization.
• Ability to develop holistic understanding of PI modules on new NAND technologies.

Responsibilities

• Lead process modules related to 3D NAND development.
• Define specifications and process requirements for assigned modules.
• Proactively identify and resolve issues for process control.

Skills

Data analysis

Problem-solving

Process integration optimization

Excellent communication skills

Education

PhD with ≥5 years experience in Electrical Engineering or related field

Master’s with ≥7 years experience in Electrical Engineering or related field

Bachelor’s with ≥10 years experience in Electrical Engineering or related field

Tools

Python

SolidWorks

Tableau

Power BI

Job description

Job Summary

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about using their expertise in the relentless pursuit of innovation for customers and partners. As a Principal Engineer in the NAND Module Process Integration Team of the Singapore R&D department at Micron Semiconductor Operation Pte Ltd, you will be responsible for designing, developing, integrating, and implementing innovative and effective process solutions to improve next‑generation 3D NAND product yield and quality with competitive cost and performance within the required timeline.

Responsibilities

• Module Ownership: Lead one or more process modules related to the development and operation of a 3D NAND semiconductor integrated circuit.
• Specification definition: Define structural specifications and process requirements for assigned modules.
• Strategic Direction: Set a clear direction and vision for the module and have a well‑defined continual improvement plan.
• Proactive Issue Resolution: Be proactive in identifying potential structure, electrical, and reliability issues and addressing them early with process control. Solve problems with a model‑based approach.
• Performance Optimization: Focus on structural development, electrical performance, parametric verification, and process control and manufacturability assessment and optimization.
• Material Innovation: Analyze materials physically, electrically, etc. and work with process groups to select new material for development. Drive material changes from research into production.
• Design Experiments: Design and implement device and process experiments to perform process development and process integration. Extract, analyze, report, and draw logical conclusions on experiments and clarify the statistical significance of the data.
• Team Leadership: Provide team leadership in module development with assembling and coordinating a development team including process engineers, etc.
• Decision‑Making & Goal Setting: Make key decisions for the team as well as provide clear direction, goals, and metrics for success of the team.
• Innovation & IP Generation: Innovate to address complex problems through both design and process. Consider new options for improving and developing new technologies or devices. Patent disclosures are expected on a regular basis.
• Multi‑functional Coordination: Coordinate activities such as reticle tapeouts, flow/traveler changes, lot management, etc. across multi‑functional teams to enable a project to proceed in a rapid and low‑error manner.
• Technology Transfer: Support the transfer of new technology from R&D to high‑volume manufacturing.
• Communication & Influence: Communicate key information and projects via presentations and group discussion and drive decisions.
• Continuous Development: Continually grow technical and management skills and pursue continued education via on‑job training and training class.

Qualifications

• Must have: Passionate about semiconductor technology and innovation. Adept at data analysis, problem‑solving, and process integration optimization. Excellent communication skills and capacity to collaborate within multi‑functional teams.
• Education: PhD ≥5 years, or Master’s ≥7 years, or Bachelor’s ≥10 years in Electrical Engineering, Microelectronics, Materials Science, Chemical Engineering, Physics, or related field with semiconductor industry experience.
• Proficiency in scripting/programming/engineering/business intelligence/Analytics software, such as Python, SolidWorks, Tableau, Power BI, etc., is desirable.
• Ability to develop a strong holistic end‑to‑end understanding of particular PI modules on new NAND technologies and related structural & electrical fail mechanisms.
• In‑depth knowledge and direct experience with non‑volatile memories (NAND) along with good understanding of the NAND process flow, the interaction of process & device, common yield & reliability issues are desirable.
• Experience in R&D and technology transfer within the semiconductor industry.
• Committed to quality, collaboration, and continuous improvement.
• Ability to be self‑motivated, and self‑governing with proven ability to work in a demanding & dynamic environment.

EEO Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.