Staff/ Principal Engineer, CMOS Process Integration, NTI

Micron Technology, Inc; Singapore; On-site; SGD 80,000 - 120,000; Full time

Benefits offered by this job

Medical, dental, and vision plans

Paid family leave

Robust paid time-off program

Job summary

Micron Technology, Inc. in Singapore is seeking a Staff/Principal Engineer for NAND CMOS Module Process Integration. This role involves designing and implementing innovative process solutions to enhance 3D NAND product yield and quality.

The ideal candidate will have a strong background in semiconductor technology, excellent problem-solving skills, and a commitment to quality and continuous improvement. Additional benefits include comprehensive medical plans and supportive work environment.

Qualifications

• Minimum of 3 years of experience in the semiconductor industry.
• Direct experience with non-volatile memories (NAND).
• Ability to develop a strong holistic understanding of particular PI modules.

Responsibilities

• Identify key module deficiencies and lead cross-functional teams.
• Develop CSPEC criteria and drive manufacturing process capability.
• Assist in the transfer of new technology from R&D to manufacturing.

Skills

Data analysis

Problem-solving

Process integration optimization

Excellent communication

Self-motivated

Education

BS, MS/PhD in Electrical Engineering, Microelectronics, Chemical Engineering, Material Science

Tools

Python

SolidWorks

Tableau

Power BI

Job description

Req. ID: JR102974 Staff/Principal Engineer, CMOS Process Integration, NTI

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

As a Staff/Principal NAND CMOS Module Process Integration Engineer in the Singapore R&D department at Micron Technology Inc., you will be responsible for designing, developing, integrating, and implementing innovative and effective process solutions to improve next-generation 3D NAND Product Yield and Quality with competitive cost and performance within the required timeline.

Responsibilities

• Identify and quantify key module deficiencies and technology gaps. Lead cross-functional teams to address these issues. Improve current process flows and develop innovative solutions to meet product requirements and manufacturability
• Develop or redefine CSPEC criteria for optimal product performance and drive activities to ensure manufacturing process capability
• Coordinate activities at the manufacturing site to secure funding for experiments, and conversions, and effectively communicate decisions to relevant R&D, Product Engineering, and Manufacturing partners
• Undertake development projects to evaluate and implement new integration schemes for alpha and derivative part types. Establish proof of concept for future tech nodes at the manufacturing facility
• Take on a leadership role at quarterly yield summits and monthly program reviews to summarize complex problems, explain actions taken to address them, and align R&D, Manufacturing, and senior management teams
• Assist in the transfer of new technology from R&D to manufacturing
• Contribute to ensuring a successful ramp-up and qualification. Support the transfer, documentation, and training of module fundamentals into manufacturing

Must have

• Passion in semiconductor technology and innovation
• Adept at data analysis, problem-solving, and process integration optimization
• Excellent communication skills and ability to work in cross-functional teams
• Committed to quality, collaboration, and continuous improvement
• Ability to be self-motivated, and self-governing with proven ability to work in a demanding & dynamic environment
• Ability to travel for extended periods to the US for collaborative R&D work

Requirements

• BS, MS/PhD in Electrical Engineering, Microelectronics, Chemical Engineering, Material Science or a related field
• Proficiency in scripting/programming/engineering/business intelligence/Analytics software, such as Python, SolidWorks, Tableau, Power BI, etc. is desirable
• Minimum of 3 years of experience in the semiconductor industry in the areas of Process Integration and Yield Enhancement
• Ability to develop a strong holistic end-to-end understanding of particular PI modules on new NAND technologies and related structural & electrical fail mechanisms
• In-depth knowledge and direct experience with non-volatile memories (NAND) along with good understanding of the NAND process flow, the interaction of process & device, common yield & reliability issues are desirable
• Exposure to R&D such as HKMG is desirable

Job Profile(s)

Semiconductor Process Engineer 4

Relocation level

TBD

Benefits

As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays.

Equal Opportunity Employment

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.