Principal/Staff Engineer, Process Integration, NTI NAND

Micron Technology; Singapore; On-site; SGD 80,000 - 120,000; Full time

Job summary

Micron Technology in Singapore is looking for a Principal/Staff Engineer, Process Integration, to work on cutting-edge 3D NAND technology. In this role, you will lead efforts on semiconductor modules, define specifications, strategize improvements, and solve complex engineering issues.

The ideal candidate has extensive experience in wafer fabrication and a strong background in both engineering and materials science. Join us in shaping the future of data storage!

Qualifications

• Minimum 5 years of experience in Wafer Fabrication Process Development.
• Strong understanding of PI modules on new NAND technologies.
• In-depth knowledge of non-volatile memories (NAND) and related issues.

Responsibilities

• Lead process modules for 3D NAND semiconductor circuits.
• Define structural specifications and process requirements.
• Optimize performance and manufacturability assessments.

Skills

Data analysis

Problem-solving

Process integration optimization

Communication skills

Collaboration

Education

Masters/PhD in Electrical Engineering, Microelectronics, Chemical Engineering, Material Science

Tools

Python

SolidWorks

Tableau

Power BI

Job description

As a Principal/Staff Engineer, Process Integration, NTI NAND at Micron, you will have the outstanding opportunity to work on groundbreaking 3D NAND technology. This technology will develop the future of data storage solutions. The role suits those who are ambitious, enjoy solving complex problems, and want to lead innovative projects that push the boundaries of what is possible.

Responsibilities

• Module Ownership: Lead one or more process modules related to the development and operation of 3D NAND semiconductor coordinated circuits.
• Specification Definition: Define structural specifications and process requirements for assigned modules.
• Strategic Direction: Set a clear direction and vision for the module and establish a continual improvement plan.
• Proactive Issue Resolution: Identify potential structure, electrical, and reliability issues early and address them with process control. Solve problems using a model-based approach.
• Performance Optimization: Focus on structural development, electrical performance, parametric verification, and process control. Optimize manufacturability assessments.
• Material Innovation: Analyze materials physically and electrically. Collaborate with process groups to select new materials for development and transition them from research to production.
• Build Experiments: Build and complete device and process experiments. Extract, analyze, report, and draw conclusions on experiments and clarify the statistical significance of the data.
• Team Leadership: Assemble and coordinate a development team, including process engineers, to drive module development.
• Decision-Making & Goal Setting: Make key decisions and provide clear direction, goals, and metrics for team success.
• Innovation & IP Generation: Innovate to address complex problems and consider new options for improving and developing new technologies. Regularly submit patent disclosures.
• Cross-Functional Coordination: Coordinate activities across cross-functional teams to enable rapid and low-error project progression.
• Technology Transfer: Support the transfer of new technology from R&D to high-volume manufacturing.
• Communication & Influence: Present key information and projects, drive decisions, and foster group discussions.
• Continuous Development: Pursue continual growth in technical and management skills through on-job training and education.

Qualifications

• Passionate about semiconductor technology and innovation.
• Adept at data analysis, problem-solving, and process integration optimization.
• Excellent communication skills and capacity to collaborate within cross-functional teams.
• Experience: Proficiency in scripting/programming/engineering/business intelligence/Analytics software, such as Python, SolidWorks, Tableau, Power BI, etc., is desirable.
• Minimum of 5 years of experience in Wafer Fabrication Process Development in Dry Etch, Photolithography, Films, Wet Process, CMP or Process Integration.
• Strong complete understanding of PI modules on new NAND technologies and related structural & electrical fail mechanisms.
• In-depth knowledge and direct experience with non-volatile memories (NAND) and understanding of the NAND process flow, interaction of process & device, and common yield & reliability issues.
• Experience in R&D and technology transfer to manufacturing.
• Committed to quality, collaboration, and continuous improvement.
• Self-motivated with a proven ability to work in a fast-paced & dynamic environment.
• Education: Masters/PhD in Electrical Engineering, Microelectronics, Chemical Engineering, Material Science, or a related field, or equivalent experience.

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.