Position Overview
As a NAND Module Process Integration Engineer in the Singapore R&D department at Micron Technology Inc., you will design, develop, integrate, and implement innovative process solutions to improve next‑generation 3D NAND product yield and quality while maintaining competitive cost and performance within the required timeline.
Responsibilities
- Identify and quantify key module deficiencies and technology gaps.
- Lead cross‑functional teams to address these issues.
- Improve current process flows and develop innovative solutions to meet product requirements and manufacturability.
- Develop or redefine CSPEC criteria for optimal product performance and drive activities to ensure manufacturing process capability.
- Coordinate activities at the manufacturing site to secure funding for experiments and conversions, and optimally communicate decisions to relevant R&D, Product Engineering, and Manufacturing partners.
- Undertake development projects to evaluate and implement new integration schemes for alpha and derivative part types.
- Establish proof of concept for future tech nodes at the manufacturing facility.
- Take on a leadership role at quarterly yield summits and monthly program reviews to summarize complex problems, explain actions taken, and align R&D, Manufacturing, and senior management teams.
- Assist in the transfer of new technology from R&D to manufacturing and contribute to ensuring a successful ramp‑up and qualification.
- Support the transfer, documentation, and training of module fundamentals into manufacturing.
Qualifications
- Passionate about semiconductor technology and innovation.
- Adept at data analysis, problem‑solving, and process integration optimization.
- Excellent communication skills and ability to work in cross‑functional teams.
Preferred Qualifications
- PhD in Material Science, Electrical Engineering, Microelectronics, Chemical or Physics Engineering, or a related field.
- At least 2 years of experience in the semiconductor industry.
- Proficiency in data analysis, visualization or simulation software such as JMP, Tableau.
- Strong holistic end‑to‑end understanding of PI modules on new NAND technologies and related structural & electrical fail mechanisms.
- In‑depth knowledge and direct experience with non‑volatile memories (NAND) and a good understanding of the NAND process flow, interaction of process & device, and common yield & reliability issues.
- Experience in semiconductor R&D product life cycle from design to manufacturing.
- Self‑motivated, self‑governing, proven ability to work in a demanding & dynamic environment.
- Display Micron Value of People: Innovation, Tenacity, Collaboration and Customer Focus.
EEO Statement
All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status. To request assistance with the application process and/or for reasonable accommodations, please contact hrsupport_sg@micron.com.
Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.