PRINCIPAL ENGINEER, NAND PI

Micron Technology, Inc; Singapore; On-site; SGD 90,000 - 130,000; Full time

Job summary

Micron Technology, Inc is seeking a Principal Engineer in Singapore to drive innovative process solutions in NAND technology development. This role involves leading module ownership, optimizing performance, and collaborating across multi-functional teams.

Ideal candidates will have extensive expertise in semiconductor processes, a passion for technology, and strong leadership capabilities in a dynamic environment.

Micron embraces equity and diversity in the workplace, encouraging all qualified applicants to apply.

Qualifications

• Passionate about semiconductor technology and innovation.
• Ability to develop a strong holistic end-to-end understanding of PI modules.
• Experience in R&D and technology transfer within Semiconductor industry.

Responsibilities

• Lead one or more process modules for 3D NAND semiconductor circuits.
• Set direction and goals for the module.
• Optimize performance through statistical analysis.
• Design experiments for process development and integration.

Skills

Data analysis

Problem-solving

Process integration optimization

Excellent communication skills

Collaboration within multi-functional teams

Education

PhD in Electrical Engineering, Microelectronics, or related field

Master’s degree (≥7 years experience)

Bachelor’s degree (≥10 years experience)

Tools

Python

SolidWorks

Tableau

Power BI

Job description

Principal Engineer, NAND PI (Evergreen)

Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

As a Principal Engineer in the NAND Module Process Integration Team in the Singapore R&D department at Micron Semiconductor Operation Pte Ltd, you will be responsible for designing, developing, integrating, and implementing innovative and effective process solutions to improve next-generation 3D NAND Product Yield and Quality with competitive cost and performance within the required timeline.

Responsibilities

• Module Ownership: Lead one or more process modules related to the development and operation of a 3D NAND semiconductor integrated circuit.
• Specification definition: Define structural specifications and process requirements for assigned modules.
• Strategic Direction: Set a clear direction and vision for the module and have a well-defined continual improvement plan.
• Proactive Issue Resolution: Be proactive in identifying potential structure, electrical and reliability issues and addressing them early with process control. Solve problems with a model-based approach.
• Performance Optimization: Focus on structural development, electrical performance, parametric verification, and process control and manufacturability assessment and optimization.
• Material Innovation: Analyze materials physically, electrically, etc. and work with process groups, etc to select new material for development. Drive material changes from research into production.
• Design Experiments: Design and implement device and process experiments to perform process development and process integration. Extract, analyze, report and draw logical conclusions on experiments and clarify the statistical significance of the data.
• Team Leadership: Provide team leadership in module development with assembling and coordinating a development team including process engineers, etc.
• Decision-Making & Goal Setting: Make key decisions for the team, as well as provide clear direction, goals and metrics for success of the team.
• Innovation & IP Generation: Innovate to address complex problems through both design and process. Consider new options for improving and developing new technologies or devices. Patent disclosures are expected on a regular basis.
• Multi-functional Coordination: Coordinate activities such as reticle tapeouts, flow/traveler changes, lot management, etc. across multi-functional teams to enable a project to proceed in a rapid and low error manner.
• Technology Transfer: Support the transfer of new technology from R&D to high volume manufacturing.
• Communication & Influence: Communicate key information and projects via presentations and group discussion and drive decisions.
• Continuous Development: Continually grow technical and management skills and pursue continued education via on-job training and training class.

Must Have

• Passionate about semiconductor technology and innovation.
• Adept at data analysis, problem-solving, and process integration optimization.
• Excellent communication skills and capacity to collaborate within multi-functional teams.

Requirements

Education

• PhD ≥5 years, or Master’s ≥7 years, or Bachelor’s ≥10 years in Electrical Engineering, Microelectronics, Materials Science, Chemical Engineering, Physics, or related field with semiconductor industry experience.
• Proficiency in scripting/programming/engineering/business intelligence/Analytics software, such as Python, SolidWorks, Tableau, Power BI, etc. is desirable.

Professional Skills

• Ability to develop a strong holistic end-to-end understanding of particular PI modules on new NAND technologies and related structural & electrical fail mechanisms.
• In-depth knowledge and direct experience with non-volatile memories (NAND) along with good understanding of the NAND process flow, the interaction of process & device, common yield & reliability issues are desirable.
• Experience in R&D and technology transfer within Semiconductor industry.
• Committed to quality, collaboration, and continuous improvement.
• Ability to be self-motivated, and self-governing with proven ability to work in a demanding & dynamic environment.

Job Profile(s)

Semiconductor Process Engineer 5

Equity & Diversity

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.