Sr Engineer, Process Integration, NAND NTI

Micron Technology, Inc; Singapore; On-site; SGD 80,000 - 120,000; Full time

Benefits offered by this job

Medical, dental, and vision plans

Paid family leave

Robust paid time-off program

Job summary

Micron Technology, Inc is looking for a Sr Engineer, Process Integration in Singapore. In this role, you will focus on developing innovative process solutions to enhance product yield and quality for next-generation 3D NAND technologies.

Your responsibilities will include coordinating with manufacturing, identifying deficiencies, and leading teams to implement improvements. The ideal candidate will hold a PhD in a relevant field and have experience in the semiconductor industry.

Benefits include comprehensive healthcare options and robust paid time-off programs.

Qualifications

• Passionate about semiconductor technology and innovation.
• 2 years of experience in the semiconductor industry.
• In-depth knowledge of non-volatile memories (NAND).

Responsibilities

• Identify and quantify key module deficiencies and technology gaps.
• Develop or redefine CSPEC criteria for optimal product performance.
• Assist in the transfer of new technology from R&D to manufacturing.

Skills

Problem solving

Process integration optimization

Data analysis

Communication skills

Education

PhD in Material Science, Electrical Engineering, Microelectronics, Chemical or Physics Engineering

Tools

JMP

Tableau

Job description

Req. ID: JR85885 Sr Engineer, Process Integration, NAND NTI

As a NAND Module Process Integration Engineer in the Singapore R&D department at Micron Technology Inc., you will be responsible for designing, developing, integrating, and implementing innovative and effective process solutions to improve next-generation 3D NAND Product Yield and Quality with competitive cost and performance within the required timeline.

Responsibilities

• Identify and quantify key module deficiencies and technology gaps. Lead cross‑functional teams to address these issues. Improve current process flows and develop innovative solutions to meet product requirements and manufacturability.
• Develop or redefine CSPEC criteria for optimal product performance and drive activities to ensure manufacturing process capability.
• Coordinate activities at the manufacturing site to secure funding for experiments, conversions, and optimally communicate decisions to relevant R&D, Product Engineering, and Manufacturing partners.
• Undertake development projects to evaluate and implement new integration schemes for alpha and derivative part types. Establish proof of concept for future tech nodes at the manufacturing facility.
• Take on a leadership role at quarterly yield summits and monthly program reviews to summarize complex problems, explain actions taken to address them, and align R&D, Manufacturing, and senior management teams.
• Assist in the transfer of new technology from R&D to manufacturing. Contribute to ensuring a successful ramp‑up and qualification. Support the transfer, documentation, and training of module fundamentals into manufacturing.

Must Have

• Passionate about semiconductor technology and innovation.
• Adept at data analysis, problem solving, and process integration optimization.
• Excellent communication skills and ability to work in cross‑functional teams.

Preferred

• PhD in Material Science, Electrical Engineering, Microelectronics, Chemical or Physics Engineering, or a related field.
• 2 years of experience in the semiconductor industry.
• Proficiency in data analysis, visualization or simulation software such as JMP, Tableau.
• Ability to develop a strong holistic end‑to‑end understanding of PI modules on new NAND technologies and related structural & electrical fail mechanisms.
• In‑depth knowledge and direct experience with non‑volatile memories (NAND) along with good understanding of the NAND process flow, the interaction of process & device, common yield & reliability issues.
• Experience in semiconductor R&D product life cycle from design to manufacturing.
• Ability to be self‑motivated, and self‑governing with proven ability to work in a demanding & dynamic environment.
• Display Micron Value of People: Innovation, Tenacity, Collaboration and Customer Focus.

Job Profile(s)

Semiconductor Process Engineer 3

Relocation Level

(TBD)

Benefits

As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time‑off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on Benefits | Micron Technology, Inc.

Equal Employment Opportunity

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.