STAFF ENGINEER, PKG SI INT

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE LTD; Singapore; On-site; SGD 120,000 - 180,000; Full time

Job summary

Micron Technology, Inc. invites a Staff Engineer, Package-Silicon Integration to advance next‑generation NAND packaging technology. You will collaborate across silicon design, wafer fabrication, package design, assembly, reliability, and manufacturing to mitigate CPI risks.

You will lead complex technical workstreams, develop integration solutions, and apply data‑driven methods including AI-enabled analytics to accelerate learning and ensure robust design and manufacturing.

Qualifications

• Bachelor’s degree or higher in a related technical discipline.
• 4–5 years of semiconductor experience in package-silicon integration or related fields.
• Ability to independently lead complex technical investigations.

Responsibilities

• Lead CPI risk assessments for new silicon and package architectures.
• Collaborate across silicon design, wafer fab, and assembly teams to resolve integration challenges.
• Lead technical investigations using DOE, statistics, and AI-driven approaches.
• Drive root-cause analysis for yield, quality, reliability, and manufacturability issues.
• Translate learnings into design rules, specifications, and manufacturing controls.
• Communicate risks and recommendations to engineering leadership.

Skills

CPI risk assessment

DOE & PFMEA

Data analytics

AI analytics

Cross-functional leadership

Education

Bachelor’s degree or higher in Mechanical, Materials, Electrical/Electronic, Chemical, Semiconductor Engineering, Physics, or related

Tools

Python

DOE Tools

Statistical Software

Job description

Our vision is to transform how the world uses information to enrich life for all.

Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing.

Staff Engineer, Package-Silicon Integration

As a Staff Engineer, Package-Silicon Integration in Micron’s Package Development Engineering (PDE) organization, you will drive package-silicon integration for next-generation NAND packaging technologies.

You will collaborate across silicon design, wafer fabrication, package design, assembly, reliability, and manufacturing to identify and mitigate chip-package interaction risks. You will independently lead complex technical workstreams, develop integration solutions, and leverage AI-enabled and data-driven methods to accelerate engineering learning and enable robust design and manufacturing solutions.

Key Responsibilities

• Lead Chip-Package Interaction (CPI) risk assessments for new silicon, package architectures, materials, and processes.
• Partner with silicon, package, wafer fab, and assembly teams to resolve dicing, singulation, die integrity, and integration challenges.
• Lead technical investigations using DOE, statistical analysis, physical characterization, failure analysis, reliability data, and AI-enabled analytical approaches where appropriate.
• Drive root-cause analysis and solutions for yield, quality, reliability, and manufacturability issues.
• Define and execute test vehicles, characterization strategies, process windows, and qualification plans.
• Translate technical learning into design rules, specifications, FMEA controls, and Best-Known Methods (BKMs).
• Leverage AI, automation, and data analytics to improve engineering efficiency, technical insight, knowledge capture, and decision-making.
• Drive technology readiness and transition of new silicon and package technologies into manufacturing.
• Identify integration and capability gaps and develop scalable technical solutions.
• Communicate technical risks, findings, and recommendations across engineering teams and leadership.
• Provide technical guidance and mentoring while promoting effective AI-enabled ways of working.

Minimum Qualifications

Education & Experience

• Bachelor’s degree or higher in Mechanical, Materials, Electrical/Electronic, Chemical, Semiconductor Engineering, Physics, or a related technical discipline.
• Min 4 to 5 years of relevant semiconductor experience in either package-silicon integration, advanced packaging, wafer technology, assembly, reliability, materials, or process development.
• Demonstrated ability to independently lead complex technical investigations.

Technical & Professional Skills

• Strong understanding of semiconductor fabrication, packaging, assembly, materials, and/or reliability.
• Experience in areas such as CPI, wafer/die mechanics, dicing, die integrity, package assembly, characterization, failure analysis, or reliability.
• Experience with DOE, statistical analysis, root-cause analysis, DFMEA/PFMEA, and structured problem solving.
• Ability to connect physical failure mechanisms to silicon, package, material, and process interactions.
• Ability to translate technical findings into design requirements, process specifications, and manufacturing controls.
• Proficiency in using data analytics, automation, and AI-enabled tools to improve engineering analysis, productivity, technical documentation, and problem solving.
• Ability to critically assess AI-generated outputs and apply engineering judgment and data validation before using them for technical decisions.
• Strong cross-functional collaboration, technical leadership, and communication skills.

About Micron Technology, Inc.

We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich lifefor all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience.

To learn more, please visit micron.com/careers

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.

To request assistance with the application process and/or for reasonable accommodations,please contact••••@micron.com

Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.

AI alert: Candidates are encouraged to use AI tools to enhance their resume and/or application materials. However, all information provided must be accurate and reflect the candidate's true skills and experiences. Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification.