Package Reliability Engineer (Semiconductors)

Micron

Singapore

On-site

SGD 78,120 - 106,020

Full time

14 days+
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Job summary

Micron Technology, Inc. in Singapore is seeking a Global Quality Package Reliability Engineer to own program quality across new products and designs.

You will lead package qualification activities, develop qualification plans, and guide release readiness based on reliability results. You will perform test planning, root cause analyses, and collaborate with internal teams and customers to ensure package reliability.

Qualifications

  • Bachelor’s degree in engineering or related field with focus on microelectronics.
  • 1–2 years in microelectronic packaging, quality or reliability engineering, or failure analysis.
  • Strong understanding of reliability test methods and life-prediction techniques.
  • Excellent problem-solving, communication, and cross-functional collaboration skills.

Responsibilities

  • Lead and coordinate package qualification for new products and processes.
  • Develop reliability test plans and screening methodologies.
  • Conduct root-cause investigations and drive corrective actions.
  • Communicate with internal teams and customers on quality and reliability.

Skills

Semiconductor packaging processes
Thermo-mechanical analysis
Reliability test methods
Statistical sampling
Root cause analysis
Communication in English
Project management
Backend manufacturing software

Education

Bachelor’s or Master’s in Engineering (Mechanical, Electronics, Materials Science) or related field

Tools

8D CAR
FMEA
Life-prediction models
Manufacturing software systems

Job description

Micron Technology, Inc. in Singapore is seeking a Global Quality Package Reliability Engineer to own program quality across new products and designs.

You will lead package qualification activities, develop qualification plans, and guide release readiness based on reliability results. You will perform test planning, root cause analyses, and collaborate with internal teams and customers to ensure package reliability.

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