Staff Engineer: Package-Silicon Integration

Micron Technology, Inc.

Singapore

On-site

SGD 120,000 - 240,000

Full time

4 days ago
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Job summary

Micron Technology, Inc. seeks a Senior/Staff/Principal Engineer, Package-Silicon Integration in Singapore to drive package-silicon integration for next-generation NAND packaging technologies.

You will lead complex technical workstreams across silicon design, wafer fabrication, package design, assembly, reliability, and manufacturing, using DOE, AI-enabled analytics, and data-driven methods to accelerate learning and ensure robust design and manufacturing solutions.

Qualifications

  • Bachelor’s degree or higher in a technical discipline as listed.
  • 1–2 years semiconductor experience in package-silicon integration or related areas.
  • Ability to lead complex technical investigations independently.

Responsibilities

  • Lead CPI risk assessments for new silicon, package architectures, materials, and processes.
  • Collaborate with silicon, package, wafer fab, and assembly teams to resolve integration challenges.
  • Drive DOE, statistical analysis, failure analysis, and AI-enabled approaches where appropriate.
  • Translate findings into design rules, specs, and manufacturing controls.
  • Communicate risks and recommendations to engineering leadership.

Skills

CPI risk assessments
DOE / statistical analysis
AI-enabled analytics
Cross-functional collaboration
Data analytics and automation
Problem solving

Education

Bachelor’s degree in Mechanical/Materials/Electrical/Electronic/Chemical/ Semiconductor Engineering or Physics

Tools

DOE tools
Statistical analysis tools

Job description

Micron Technology, Inc. seeks a Senior/Staff/Principal Engineer, Package-Silicon Integration in Singapore to drive package-silicon integration for next-generation NAND packaging technologies.

You will lead complex technical workstreams across silicon design, wafer fabrication, package design, assembly, reliability, and manufacturing, using DOE, AI-enabled analytics, and data-driven methods to accelerate learning and ensure robust design and manufacturing solutions.

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