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Micron Technology, Inc. seeks a Senior/Staff/Principal Engineer, Package-Silicon Integration in Singapore to drive package-silicon integration for next-generation NAND packaging technologies.
You will lead complex technical workstreams across silicon design, wafer fabrication, package design, assembly, reliability, and manufacturing, using DOE, AI-enabled analytics, and data-driven methods to accelerate learning and ensure robust design and manufacturing solutions.
Micron Technology, Inc. seeks a Senior/Staff/Principal Engineer, Package-Silicon Integration in Singapore to drive package-silicon integration for next-generation NAND packaging technologies.
You will lead complex technical workstreams across silicon design, wafer fabrication, package design, assembly, reliability, and manufacturing, using DOE, AI-enabled analytics, and data-driven methods to accelerate learning and ensure robust design and manufacturing solutions.