Senior Yield & Process Integration Engineer

UNITED TEST AND ASSEMBLY CENTER LTD

Singapore

On-site

SGD 60,000 - 100,000

Full time

14 days+

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Job summary

UNITED TEST AND ASSEMBLY CENTER LTD in Singapore is seeking an experienced Yield Engineer focused on process yield engineering and bump process integration. You will collaborate with cross-functional teams to troubleshoot issues in Dry and Wet wafer bumping and lead DOE initiatives.

The role requires a degree in engineering and at least 3 years in semiconductors, with strong skills in SPC, APQP and data analysis, plus problem-solving and analytical abilities to drive improvements and support

Qualifications

Degree in engineering is required.
Minimum 3 years of relevant semiconductor experience.
Familiar with SPC, APQP, and data analysis tools.
Strong problem-solving and analytical skills.

Responsibilities

Focus on process yield engineering and bump process integration; collaborate with cross-functional teams to troubleshoot and resolve issues in Dry and Wet wafer bumping, including DOEs.
Responsible for data analysis for yield and trend detection.
Lead continuous improvement projects and device qualifications using APQP approach.
Execute CIP or projects that improve yield and cost efficiency.
Review and propose updates to SPC limits to improve product quality and stability.
Take ownership of customer technical inquiries and lead NPI-to-mass production transitions.
Coordinate customer-initiated BKM exercises.