Senior/ Engineer – NPI

UTAC

Singapore

On-site

SGD 90,000 - 130,000

Full time

6 days ago
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Qualifications

  • Degree/Diploma in Electrical/Electronics, Engineering or equivalent.
  • Minimum 3 years of Engineering experience in Semiconductor manufacturing industry.
  • Preferably with Project Management Certification.
  • Knowledge of how bumping, assembly material interact with package workmanship and reliability would be preferred.
  • Knowledge on WLCSP bumping process of 2P2M; DOE/SPC / FMEA /JMP/ APQP standard.
  • Bumping process knowledge on (Lithography, Sputter, Etching, Plating, Descum & Ball drop process preferred)

Responsibilities

  • Manages internal and customer projects from engagement until project closure through proper planning and timely execution by working with internal cross-functional teams and customer
  • Maintains documentation of customer projects starting from Kick-off, Engineering build, Qualification and Off-load to full production
  • Reviews and analyses customer’s specifications and requirements in terms of material, process and assembly specification
  • Initiates team discussion/ review on customer document gaps/ discrepancies and recommend proposals to customer
  • Plan and generate detailed customer project activity timeline, track progress and anticipate potential issues and resolve it with internal stakeholders
  • Ensures that customer indices are monitored and reviewed by having regular meet-up and review of team performance
  • Develop and grow people project management skills, adopting on dynamic changes and crisis management
  • Drive for productivity improvement and cost reduction in process integration
  • Work with TPM/ Sales/ customer for new design win and handle NPI engineering activities- reliability / Yield and Quality issue

Skills

Project management
Cross-functional collab
Documentation
Customer engagement
NPI engineering
Problem solving

Education

Electrical/Electronics Engineering

Tools

JMP
DOE
SPC
FMEA
APQP

Job description

  • Manages internal and customer projects from engagement until project closure through proper planning and timely execution by working with internal cross-functional teams and customer
  • Maintains documentation of customer projects starting from Kick-off, Engineering build, Qualification and Off-load to full production
  • Reviews and analyses customer’s specifications and requirements in terms of material, process and assembly specification
  • Initiates team discussion/ review on customer document gaps/ discrepancies and recommend proposals to customer
  • Plan and generate detailed customer project activity timeline, track progress and anticipate potential issues and resolve it with internal stakeholders
  • Ensures that customer indices are monitored and reviewed by having regular meet-up and review of team performance
  • Develop and grow people project management skills, adopting on dynamic changes and crisis management
  • Drive for productivity improvement and cost reduction in process integration
  • Work with TPM/ Sales/ customer for new design win and handle NPI engineering activities- reliability / Yield and Quality issue

Requirements:

  • Degree/Diploma in Electrical/Electronics, Engineering or equivalent
  • Minimum 3 years of Engineering experience in Semiconductor manufacturing industry
  • Preferably with Project Management Certification
  • Knowledge of how bumping, assembly material interact with package workmanship and reliability would be preferred
  • Knowledge on WLCSP bumping process of 2P2M; DOE/SPC / FMEA /JMP/ APQP standard
  • Bumping process knowledge on (Lithography, Sputter, Etching, Plating, Descum & Ball drop process preferred
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