Senior Engineer/ Engineer - Thin Film CMP Equipment

VANGUARD INTERNATIONAL SEMICONDUCTOR SINGAPORE PTE. LTD.; Singapore; On-site; SGD 60,000 - 90,000; Full time

Job summary

VANGUARD INTERNATIONAL SEMICONDUCTOR SINGAPORE PTE. LTD. seeks a skilled Equipment Maintenance Lead to own, maintain and improve key indices such as quality, uptime and cost.

You will sustain KPIs, drive continuous improvements, and coordinate with process and Manufacturing Engineers to ensure objectives are met. Responsibilities include managing logistics and maintenance spend while coaching junior engineers.

Qualifications

• Requires degree in Electrical/ Electronics/ Mechanical/ Mechatronics/ Microelectronics Engineering.
• Minimum 3 years of experience in Thin Film CMP Equipment.
• Strong interpersonal and written communication skills.
• Excellent analytical and logical thinking abilities.
• Demonstrates leadership with ownership and accountability.

Responsibilities

• Own, maintain and improve Quality, Uptime and Cost indices.
• Sustain equipment KPI and drive continuous improvements.
• Monitor and optimize equipment performance and PM procedures for efficiency.
• Coordinate with Process and Manufacturing Engineers for module objectives.
• Manage logistics and expenditure for maintenance to prevent downtime.
• Coach and mentor subordinates and document best practices for ROI.
• Participate in CIP programs to optimize equipment utilization and cost.
• Be the technical expert for the machine specialization.
• Use SPACE to monitor SPC charts and JMP for engineering experiments.
• Coordinate new equipment start-up from facilities hookup to acceptance for production.

Skills

Teamwork

Analytical thinking

Communication skills

Leadership

Ownership & accountability

Education

Electrical / Electronics / Mechanical / Mechatronics / Microelectronics Engineering degree

Tools

SPACE

JMP

PROMIS (SiView) DC OP SPC

MS Office

Job description

Job Description:

• To own, maintain and improve the following indices: Quality, Uptime and Cost.
• Sustain equipment KPI and make continuous improvements to enhance the performance.
• Monitor and control equipment performance indices. Optimize PM procedures to make it more effective and efficient.
• Coordinate with both process and Manufacturing Engineers to ensure work is carried out efficiently to meet module objectives.
• Manage the logistics for parts so as to prevent prolonged uptime losses in the case of equipment failure.
• Manage the expenditure allocated for equipment maintenance without compromising on quality output.
• Continuous improvement of equipment KPI in terms of quality, uptime and costs.
• Plan and implement an effective Preventive Maintenance program on equipment.
• Coach and Mentor subordinates to ensure that skill level and knowledge are up to date, and continuously give feedback on their work performance.
• Document Corrective Action and Best Known Methods, and Fan it out to all for maximum ROI and learning.
• Participate in CIP programs to optimize equipment utilization and cost of maintenance.
• Become the technical Expert for the respective machine specialization.
• Know how to use SPACE to monitor and analyze SPC charts. Know how to use JMP to analyze engineering experiments.
• Know how to use measurement instruments effectively in data collection.
• Understand FMEA and be able to generate FMEA analysis for new tool. Able to utilize it to identify tool weaknesses and derive the top 3 to 5 risk factors.
• Able to create PROMIS (SiView) DC OP and SPC charts.
• Coordinate new equipment start-up to support production, from facilities hookup, vendor startup, to acceptance of equipment for production.
• Wafer scrap reduction awareness and mindset.
• Follow up on SPSR, MRB, 8D, TECN, and ECN documentation for closure of issues / events. Provide guidance to Junior Engineers.
• Self audit and update specifications to meet TS16949 Quality Standard requirements.
• Set Expectation and carry out performance appraisal for Technician or AE as instructed by Section Manager.

Requirements:

• Degree in Electrical / Electronics / Mechanical / Mechatronics / Microelectronics Engineering
• Min 3 years of relevant work experience in Thin Film CMP Equipment.
• An excellent team player with good interpersonal, communication and written skills
• Strong logical thinking capability and good analytical skill
• High level of integrity with strong leadership attributes to lead and coach a team
• Highly committed with good ownership and accountability
• Able to adapt in a fast pace environment and work under pressure
• Proficient in MS Office Applications