Senior Engineer, APTD Operations

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD.; Singapore; On-site; SGD 120,000 - 180,000; Full time

Job summary

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD. is seeking an Operations Management professional to oversee technology development and engineering builds in collaboration with internal and external teams.

You will define build plans, align dependencies, forecast resources, and optimize schedules while leading cross-functional improvement initiatives across programs. This role emphasizes AI-enabled enhancements and rigorous documentation in a fast-paced global manufacturing network.

Qualifications

• Bachelor's or master's degree in a relevant engineering field.
• 3-5+ years in Semiconductor Frontend/Backend Manufacturing, with at least 1 year of HBM experience.
• Experience in Project/Process Integration, Project/Program Management, Technology Development, Operations Management, or Process Engineering.
• Solid understanding of advanced packaging flows.
• Proficiency in Excel, Confluence, Power BI, and Power Apps.
• Knowledge of SAP, Teamcenter, and manufacturing execution systems.
• Strong analytical and problem-solving capabilities.
• Outstanding communication, leadership, and stakeholder management skills.
• Ability to work independently and collaboratively in a fast-paced environment.

Responsibilities

• Handle technology development and engineering builds in partnership with internal and external teams such as process, equipment, metro RDA, site planning and manufacturing.
• Define and execute build plans, priorities, milestones, and schedules with cross-functional stakeholders.
• Align plans, dependencies, and deliverables to ensure timely, cohesive execution to meet program requirements.
• Forecast build, material, cost, and resource requirements, maintaining accurate planning data and tools. Drive for the resource readiness and ensure timely availability of required resources to support TD projects.
• Optimize build schedules, material preparation, and logistics to align with business priorities and minimize waste and delays.
• Supervise daily execution, including wafer offloading, kitting, and support of TD builds.
• Support the logistics tasks as needed according to project requirements (Materials sending/receiving, submit the sample for failure analysis etc.).
• Coordinate engineering builds and APTD operations in compliance with established standards and processes.
• Facilitate regular reviews and meetings to track progress and address challenges for the operation readiness.
• Monitor and communicate the status and overall health to stakeholders.
• Lead cross-functional improvement initiatives and build strong stakeholder partnerships across programs.
• Proactively identify and resolve risks, issues, and roadblocks, escalates as needed to protect timelines.
• Centralize and manage project documentation and data using SharePoint and Confluence.
• Ensure all deliverables and artifacts meet program requirements and align with established business processes.
• AI Responsibilities: Integrates AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational standards and legal requirements.
• Contributes to a culture of continuous improvement by identifying, testing, and sharing AI-enabled enhancements within one’s scope of work.

Skills

Advanced packaging flows

Project/Process Integration

Operations Management

Analytical problem solving

Communication & leadership

SAP knowledge

Teamcenter knowledge

Manufacturing execution systems

Power BI

Power Apps

Confluence

Excel

Education

Bachelor’s or Master’s in Materials/Mechanical/Chemical/Electrical/Electronic Engineering

3-5+ years in Semiconductor Frontend/Backend Manufacturing with 1 year HBM experience

Tools

SAP

Teamcenter

Manufacturing execution systems

Job description

Operations Management

• Handle technology development and engineering builds in partnership with internal and external teams such as process, equipment, metro RDA, site planning and manufacturing.

• Define and execute build plans, priorities, milestones, and schedules with cross-functional stakeholders.

• Align plans, dependencies, and deliverables to ensure timely, cohesive execution to meet program requirements.

• Forecast build, material, cost, and resource requirements, maintaining accurate planning data and tools. Drive for the resource readiness and ensure timely availability of required resources to support TD projects.

• Optimize build schedules, material preparation, and logistics to align with business priorities and minimize waste and delays.

• Supervise daily execution, including wafer offloading, kitting, and support of TD builds.

• Support the logistics tasks as needed according to project requirements (Materials sending/receiving, submit the sample for failure analysis etc.

• Coordinate engineering builds and APTD operations in compliance with established standards and processes.

• Facilitate regular reviews and meetings to track progress and address challenges for the operation readiness.

• Monitor and communicate the status and overall health to stakeholders.

• Lead cross-functional improvement initiatives and build strong stakeholder partnerships across programs.

• Proactively identify and resolve risks, issues, and roadblocks, escalates as needed to protect timelines.

• Centralize and manage project documentation and data using SharePoint and Confluence.

• Ensure all deliverables and artifacts meet program requirements and align with established business processes

  AI Responsibilities:

• Integrates AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational standards and legal requirements.

• Contributes to a culture of continuous improvement by identifying, testing, and sharing AI-enabled enhancements within one’s scope of work.
  

  
  Education and Experience

• Bachelor’s or master’s degree or equivalent experience in Materials, Mechanical, Chemical, or Electrical/Electronic Engineering.

• 3-5+ years’ experience in Semiconductor Frontend/Backend Manufacturing, preferably minimum 1 year of HBM experience

• Experience in Project/Process Integration, Project/Program Management, Technology Development, Operations Management, or Process Engineering.

• Solid understanding of advanced packaging flows

• Proficiency in essential computer applications, including Excel, Word, statistical tools, Confluence, Power BI, and Power Apps.

• Knowledge of SAP, Teamcenter and manufacturing execution systems.

• Knowledge of Project Management Tools/Systems.

• Strong analytical and problem-solving capabilities.

• Outstanding communication, leadership, and stakeholder management skills.

• Ability to work independently and collaboratively in a fast-paced environment.

• Demonstrated excellence in leading teams within a global manufacturing network composed of members from diverse fields and cultures.