Staff/Principal, APTD CEM - Advanced Packaging Wafer Level Technology Engineering

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD.; Singapore; On-site; SGD 120,000 - 180,000; Full time

Job summary

Micron Semiconductor Asia Operations PTE. LTD. in Singapore seeks a senior engineer to develop and deploy post-fab wafer finishing processes for high-performance memory technologies.

You will coordinate with peers across organizations to launch new technologies and integration flows that drive performance, cost, manufacturability, quality and reliability. The role emphasizes collaboration with Package Integration, Assembly Engineering, Front End Wafer Fab, Assembly/Test Engineering, Product

Qualifications

• PhD/Master/Bachelor with extensive relevant experience in semiconductor process development.
• Experience in wafer bonding, plating, warpage control and packaging is preferred.
• Strong data analytics capabilities to support SPC, DOE, defect analysis, and dashboarding.

Responsibilities

• Establish and improve wafer-level process conditions (wafer thinning, backside metal interconnect).
• Upgrade process capabilities and reduce production costs.
• Deliver technology node requirements and scaling for next node.

Skills

Python

R

SQL

Process modeling

Data analytics

Process flows

Education

PhD with ≥2 years, or Master’s with ≥5 years, or Bachelor’s with ≥7 years in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or related field

Tools

Visual Basic

E3

FDC

RMS

Job description

Role Summary:

We are currently experiencing a ground-breaking period in artificial intelligence (AI), where AI is anticipated to become an integral component of daily life. This proliferation is being fueled by advances in memory and compute technologies. High bandwidth memory (HBM) is at the forefront of these innovations. Micron’s Advanced Packaging Technology Development (APTD) is responsible to deliver package development for high performance memory products and transfer to manufacturing.

Your responsibilities include but are not limited to developing and enabling deployment of processes related to the post-fab wafer finishing processes in semiconductor manufacturing to meet performance, cost, manufacturability, quality, reliability and schedule requirements. You will have opportunity to work with peers and partners across organizations to coordinate the development and launch of new technologies and integration flows for solutions that drive the future.

Main Responsibilities:

Process Development:

• Establish and improve Wafer level process conditions and technologies (wafer thinning, backside metal interconnect)

• Upgrade process capabilities and reduce production costs

• Establish and improve process management projects to deliver technology node requirements and scaling for next node.

Equipment and Materials:

• Evaluate and promote new equipment and materials to enhance process capabilities

• Set up process parameters for a variety of semiconductor equipment

• Evaluate, promote, and plan for new equipment and materials

Quality Improvement:

• Ensure defense coverage through process, measurement, inspection, and testing

• Establish correlations between defense mechanisms to identify improvement opportunities

• Conduct continuous data analysis to establish advanced controls and identify improvement opportunities

Collaboration and Coordination:

• Work closely with internal and external partners to build and execute technology development strategies aligned with organizational and business objectives

• Work closely with various teams, including the Package Integration, Assembly Engineering, Front End Wafer Fab, Assembly/Test Engineering, Product Engineering, and Global Quality, to integrate manufacturing processes for optimal performance and quality control

• Ensure smooth transition from new product development, qualification, small volume production to high volume production

• Provide Process Of Record (POR) and Model Of Record (MOR) documentation for product transfer to production High Volume Manufacturing Fabrication facilities

AI Responsibilities:

• Integrates AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational standards and legal requirements.

• Contributes to a culture of continuous improvement by identifying, testing, and sharing AI-enabled enhancements within one’s scope of work.

Candidate Profile

Minimum Required Qualifications:

• PhD with ≥2 years, or Master’s degree with ≥5 years, or Bachelor’s degree with ≥7 years of relevant experience in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or a related field.

• Semiconductor process development, preferably in wafer bonding, plating, warpage control and packaging field.

Must Have Technical Skills:

• Proficiency in Python, R, SQL for statistical analysis, process modeling, and data analytics.

• Experience with Visual Basic for automation and tool integration.

• Familiarity with E3, FDC (Fault Detection and Classification), and RMS (Recipe Management System) for equipment and process control.

• Strong data analytics capabilities to support SPC, DOE, defect analysis, and dashboarding.

• Strong understanding of process flows, process interactions, and how process changes can affect yield, performance, and reliability

Must Have Soft Skills:

• Strong analytical and problem-solving capabilities.

• Outstanding communication, leadership, and stakeholder management skills.

• Ability to work independently and collaboratively in a fast-paced environment.

• Ability to work cross-functionally with process, equipment, and reliability teams.

AI Requirements:

• Ability to apply baseline digital fluency and role‑appropriate AI literacy to use AI‑enabled tools responsibly and effectively for research, analysis, content creation, problem‑solving, operational tasks, and achieving business outcomes.

Embody Micron’s core values:

• People – Respect, develop, and empower others

• Innovation – Drive continuous improvement and breakthrough thinking

• Tenacity – Show grit and determination

• Collaboration – Build trust and foster teamwork

• Customer Focus – Deliver excellence and value

• Speed – Act with purpose and set the pace