Senior Engineer, APTD CEM - Advanced Packaging Integration Engineering

micron semiconductor asia operations pte. ltd.; Singapore; On-site; SGD 90,000 - 140,000; Full time

Job summary

Micron Semiconductor Asia Operations Pte. Ltd. in Singapore is seeking an Advanced Packaging Integration Engineer to join the Advanced Packaging Technology Development (APTD) team.

You will develop and enable advanced packaging technologies to meet performance, cost, manufacturability, quality, reliability and schedule requirements. You will identify yield-related breakthroughs and collaborate with cross-functional teams to deploy new technologies and integration flows, ensuring smooth

Qualifications

• PhD with or Master’s degree with ≥3 years, or Bachelor’s degree with ≥5 years in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or related field.
• Semiconductor process integration experience, preferably with know-how to develop and enable advanced package technology for post-fab wafer finish and assembly processes.

Responsibilities

• Develop and enable advanced package technology for various post-fab wafer finish and assembly processes.
• Focus on improving product quality, driving yield improvements, reducing costs, and enhancing productivity.
• Integrate semiconductors while partnering with process and product engineering teams.
• Achieve and improve yields through silicon package integration innovation, not limited to layout/design or process margin improvements.
• Collect and analyze data to provide actionable outcomes and decisions for layout, design, or integration flow changes.
• Work with Probe, Yield Analysis, Test, and Product Engineering teams to drive improvements.

Skills

Python

R

SQL

DOE

Data analytics

Process integration

Analytical thinking

Education

PhD or Master’s with ≥3 years

Bachelor’s with ≥5 years

Tools

Visual Basic for automation

E3

FDC

RMS

Job description

Job De ion

Role Summary:

We are currently experiencing a ground-breaking period in artificial intelligence (AI), where AI is anticipated to become an integral component of daily life. This proliferation is being fueled by advances in memory and compute technologies. High bandwidth memory (HBM) is at the forefront of these innovations. Micron's Advanced Packaging Technology Development (APTD) is responsible to deliver package development for high performance memory products and transfer to manufacturing.

We are looking for an Advanced Packaging Integration Engineer to join our Advanced Packaging Technology Development (APTD) team!

Your responsibilities include but are not limited to developing and enabling deployment of advanced packaging technologies to meet performance, cost, manufacturability, quality, reliability and schedule requirements. You will also be required to identify, diagnose, and propose yield related breakthroughs. You will have opportunity to work with peers and partners across organizations to coordinate the development and launch of new technologies and integration flows for solutions that drive the future.

Main Responsibilities:

Technology Development:

• Develop and enable advanced package technology for various post-fab wafer finish and assembly processes

• Focus on improving product quality, driving yield improvements, reducing costs, and enhancing productivity

• Integrate semiconductors while partnering with process and product engineering teams

Yield Improvement:

• Achieve and improve yields through silicon package integration innovation, not limited to layout/design or process margin improvements .

• Collect and analyze data to provide actionable outcomes and decisions for layout, design, or integration flow changes .

• Work with Probe, Yield Analysis, Test, and Product Engineering teams to drive improvements

Quality Improvement:

• Ensure defense coverage through process, measurement, inspection, and testing

• Establish correlations between defense mechanisms to identify improvement opportunities

• Conduct continuous data analysis to establish advanced controls and identify improvement opportunities

Collaboration and Coordination:

• Work closely with internal and external stakeholders to build and execute technology development strategies aligned with organizational and business objectives

• Work closely with various teams, including the PWF Engineering, Assembly Engineering, Front End Wafer Fab, Assembly/Test Engineering, Product Engineering, and Global Quality, to integrate manufacturing processes for optimal performance and quality control

• Ensure smooth transition from new product development, qualification, small volume production to high volume production

• Provide Process Of Record (POR) and Model Of Record (MOR) documentation for product transfer to production High Volume Manufacturing Fabrication facilities

AI Responsibilities:

• Integrates AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational standards and legal requirements.

• Contributes to a culture of continuous improvement by identifying, testing, and sharing AI-enabled enhancements within one's scope of work.

Candidate Profile

Minimum Required Qualifications:

• PhD with or Master's degree with ≥3 years, or Bachelor's degree with ≥5 years of relevant experience in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or a related field.

• semiconductor process integration experience, preferably with know-how to develop and enable advanced package technology for post-fab wafer finish and assembly processes .

Must Have Technical Skills:

• Proficiency in Python, R, SQL for statistical analysis, process modeling, and data analytics.

• Experience with Visual Basic for automation and tool integration.

• Familiarity with E3, FDC (Fault Detection and Classification), and RMS (Recipe Management System) for equipment and process control.

• Strong data analytics capabilities to support SPC, DOE, defect analysis, and dashboarding.

• Strong understanding of process flows, process interactions, and ability to integrate semiconductors while partnering with process and product engineering team

Must Have Soft Skills:

• Strong analytical and problem-solving capabilities.

• Outstanding communication, leadership, and stakeholder management skills.

• Ability to work independently and collaboratively in a fast-paced environment.

• Ability to work cross-functionally with process, equipment, and reliability teams.

AI Requirements:

• Ability to apply baseline digital fluency and role‑appropriate AI literacy to use AI‑enabled tools responsibly and effectively for research, analysis, content creation, problem‑solving, operational tasks, and achieving business outcomes.

Embody Micron's core values:

• People - Respect, develop, and empower others

• Innovation - Drive continuous improvement and breakthrough thinking

• Tenacity - Show grit and determination

• Collaboration - Build trust and foster teamwork

• Customer Focus - Deliver excellence and value

• Speed - Act with purpose and set the pace