Senior Advanced Packaging & Integration Technologist

Merck Electronics

Singapore

On-site

SGD 180,000 - 240,000

Full time

9 days ago

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Job summary

Merck Electronics in Singapore seeks a Senior Advanced Packaging leader to drive opportunity definition, ecosystem engagement, and program development from concept to transfer to high-volume manufacturing.

The ideal candidate has a Master of Science in engineering and 10+ years in 300mm process and equipment R&D, with hands-on experience in thin film deposition, CMP, bonding, and patterning, plus external collaboration with industry consortia.

Qualifications

  • Master of Science degree or higher in Mechanical, Electrical, Chemical Engineering, or related field.
  • 10+ years of experience developing integration and process flows in advanced packaging.
  • 10+ years of hands-on 300mm process and equipment R&D experience.
  • Experience as an Advanced Packaging 300mm Equipment Tool Owner.

Responsibilities

  • Identify key Advanced Packaging inflection points and roadmaps.
  • Acquire strategic knowledge of customer/OEM roadmaps.
  • Transfer knowledge on Advanced Packaging roadmaps to peers and leadership.
  • Work with multiple business units to identify material solutions and developments.
  • Engage ecosystem to pursue collaborative development opportunities.
  • Ensure datasets and development programs meet industry standards.

Skills

10+ years experience
Advanced Packaging expert
External collaboration
Strategic industry knowledge

Education

Master of Science degree or higher in Mechanical, Electrical, Chemical Engineering

Tools

Advanced Packaging 300mm Equipment
Thin Film Deposition
Chemical Mechanical Planarization
Bonding / Patterning processes

Job description

Merck Electronics in Singapore seeks a Senior Advanced Packaging leader to drive opportunity definition, ecosystem engagement, and program development from concept to transfer to high-volume manufacturing.

The ideal candidate has a Master of Science in engineering and 10+ years in 300mm process and equipment R&D, with hands-on experience in thin film deposition, CMP, bonding, and patterning, plus external collaboration with industry consortia.

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