Director, Process Support — Advanced Packaging

Applied Materials, Inc.; Singapore; On-site; SGD 250,000 - 450,000; Full time

Job summary

Applied Materials, Inc. in Singapore seeks a Director, Process Support Engineer to lead advanced packaging initiatives and drive customer-focused process optimization. You will partner with customers and R&D teams to shape technology adoption, with emphasis on high‑impact packaging solutions.

The role requires senior expertise in wafer‑level packaging, 2.5D/3D integration, and cross‑functional leadership to influence product roadmaps and accelerate technology adoption in a global context.

Qualifications

• PhD, Master’s, or Bachelor’s degree in relevant engineering/science fields.
• 15+ years in semiconductor industry with advanced packaging experience.
• Expertise in Fan‑Out, CoWoS, 2.5D/3D integration, RDL, TSV, hybrid bonding, CMP, wafer‑level processing, and heterogeneous integration.
• DOE, statistical process control, failure analysis, root cause investigation, and yield improvement.
• Experience with leading foundries, OSATs, IDMs, or semiconductor equipment suppliers.
• Proven ability to influence customers and stakeholders across technical and executive levels.

Responsibilities

• Lead resolution of highly complex customer process challenges across advanced packaging applications using systematic troubleshooting, root cause analysis, statistical methodologies, and DOE.
• Establish and drive cross‑functional issue management mechanisms, coordinating resources across Business Units, Engineering, Service, Product Development, and Customer Support for timely resolution.
• Provide technical leadership for customer demonstrations, proof‑of‑concept activities, and technology evaluations, including defining process conditions and presenting recommendations.
• Partner with strategic customers to develop and optimize advanced packaging process flows, translating requirements into viable technical solutions.
• Act as a trusted advisor for advanced packaging technologies, including wafer‑level packaging, fan‑out, RDL, hybrid bonding, bumping, TSV, and heterogeneous integration.
• Collaborate with product development and engineering to influence roadmaps and drive process/hardware enhancements.
• Lead technology transfer and customer enablement, including program development and production ramp support.
• Build strategic partnerships with semiconductor manufacturers, OSATs, research institutes, and ecosystem partners.
• Drive joint development programs, beta‑site evaluations, and customer collaborations.
• Represent Applied Materials at executive customer engagements, delivering technical presentations and influencing decision makers.
• Capture and communicate customer insights and lessons learned to strengthen product offerings.

Skills

15+ years semicon experience

Advanced packaging

DOE

Statistical process control

Cross-functional leadership

Executive communication

Education

PhD, Master’s, or Bachelor’s degree in Materials Science, Chemical Engineering, Electrical Engineering, Physics, Mechanical Engineering, or related

Job description

Applied Materials, Inc. in Singapore seeks a Director, Process Support Engineer to lead advanced packaging initiatives and drive customer-focused process optimization. You will partner with customers and R&D teams to shape technology adoption, with emphasis on high‑impact packaging solutions.

The role requires senior expertise in wafer‑level packaging, 2.5D/3D integration, and cross‑functional leadership to influence product roadmaps and accelerate technology adoption in a global context.