Senior Process Engineer: Advanced Packaging & Deposition

applied materials singapore technology pte. ltd.; Singapore; On-site; SGD 180,000 - 240,000; Full time

Job summary

Applied Materials Singapore Technology Pte. Ltd.

seeks a senior leader to drive development and scaling of next‑generation advanced packaging technologies, leveraging PVD, CVD, and ALD to support customer roadmaps and resolve key technical challenges. You will manage engineers, collaborate with customers and research organizations, address high-value process engineering problems, and ensure compelling product demonstrations.

Qualifications

• Deep technical expertise in semiconductor thin-film deposition and materials engineering.
• Strong understanding of packaging applications and process integration.
• Experience supervising or managing teams.

Responsibilities

• Lead development and scaling of next-generation advanced packaging technologies using PVD/CVD/ALD.
• Drive roadmaps for advanced packaging and 3D integration with customers and cross-functional teams.
• Manage engineers in hardware characterization and applying new technologies.
• Interface with key customers to address high-value process engineering problems.
• Ensure effective product and technology demonstrations.
• Collaborate with executives and managers to execute strategic plans.
• Lead market share improvement efforts.

Skills

Semiconductor

Thin-film deposition

PVD/CVD/ALD

Team leadership

Problem solving

Job description

Applied Materials Singapore Technology Pte. Ltd.

seeks a senior leader to drive development and scaling of next‑generation advanced packaging technologies, leveraging PVD, CVD, and ALD to support customer roadmaps and resolve key technical challenges. You will manage engineers, collaborate with customers and research organizations, address high-value process engineering problems, and ensure compelling product demonstrations.