Senior Frontend Engineer: AI-Driven Packaging & Yield

1100 Micron SemiAsiaOP Pte Ltd

Singapore

On-site

SGD 180,000 - 240,000

Full time

4 days ago

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Job summary

Micron Technology, Inc. in Singapore seeks a FE CPIE CPI PI Senior Engineer to drive packaging product yield, quality improvement and NPI using AI-enabled engineering and cross-functional collaboration.

You will connect Front End manufacturing with Packaging Tech to develop and qualify processes ahead of product qualification, leading a PI Loop and global project execution. Travel is expected to 20–50% and you will mentor teams while presenting updates.

Qualifications

Bachelor’s or Master’s degree in EE, microelectronics, physics, chemistry, materials science or related field.
5+ years in semiconductor device physics, DRAM operations, wafer fabrication, parametric/electrical test and probe yield.
3 years in DRAM HPM, BEOL integration, advanced packaging and layout.
Strong data analysis, troubleshooting, and presentation skills.
Willingness to travel 20–50% and collaborate across functions.
Experience with AI, data analytics and digital tools to improve engineering decisions.

Responsibilities

Lead packaging technology development and interaction with Front End manufacturing.
Drive yield, process optimization and NPI through cross-functional teams.
Utilize AI-enabled tools to accelerate root cause analysis and productivity.
Present project updates to stakeholders and drive continuous improvement.
Travel to Micron Fab locations as needed.