Application Engineer: Die Bonding & Advanced Packaging

THE SUPREME HR ADVISORY PTE. LTD.

Singapore

On-site

SGD 33,000 - 67,000

Full time

3 days ago

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Job summary

The Supreme HR Advisory Pte. Ltd. is hiring a Die Bonding Engineer to lead design, development, and validation of software and hardware for advanced semiconductor die bonding processes in our Woodlands facility.

You will analyze customer requirements, translate them into packaging solutions, work with cross-functional teams, and provide on-site training and support to customers to maximize tool performance and yield.

Qualifications

Bachelor's or Master's degree in Engineering (Mechanical, Electrical, Materials, or related field).
3+ years of experience in semiconductor packaging, die bonding equipment, or advanced electronics manufacturing preferred.
Strong knowledge of advanced packaging technologies, such as Flip-Chip, PoP, wafer-level, or panel-level bonding.
Experience with semiconductor equipment integration, motion control systems, and process development.
Hands-on troubleshooting and problem-solving skills in a high-tech manufacturing or lab environment.
Willingness to travel for customer support and on-site installations (as required).

Responsibilities

Lead design, development, optimization, and validation of software/hardware for die bonding.
Analyze customer requirements into semiconductor packaging solutions with focus on process optimization.
Troubleshoot and fix die attach tools, process issues, and software anomalies; implement corrective actions.
Perform machine setup, calibration, and alignment for optimal yield.
Develop test procedures and documentation for process qualification and validation.
Collaborate with R&D, software, mechanical, electrical, quality, and manufacturing teams.
Provide on-site support and training for field engineers and customers.
Interface between customers and R&D to guide tool enhancements.