Lead Semiconductor Die Bonding Process Engineer

THE SUPREME HR ADVISORY PTE. LTD.

Singapore

On-site

SGD 33,000 - 67,000

Full time

14 days+

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Job summary

THE SUPREME HR ADVISORY PTE. LTD. is seeking an engineering professional to lead design, development, optimization, and validation of packaging applications for advanced die bonding processes in Woodlands.

Working days are Monday to Friday, from 9:00am to 6:00pm, with a starting salary of SGD 3,000 to SGD 6,000. The role requires analyzing customer requirements and translating them into tailored semiconductor packaging solutions, focusing on process optimization and application performance.

Qualifications

Bachelor’s or Master’s degree in Engineering required.
3+ years in semiconductor packaging or die bonding equipment.
Strong knowledge of advanced packaging technologies (Flip-Chip, PoP, wafer-/panel-level).

Responsibilities

Lead design, development, optimization, and validation of packaging applications for die bonding.
Translate customer requirements into customized packaging solutions emphasizing performance.
Troubleshoot and analyze failures in die attach tools and processes; implement corrective actions.
Set up machines, calibrate, and align to ensure optimal yield and repeatability.
Provide on-site support and training to customers; collaborate with R&D and manufacturing teams.